Kaneka Corporation

Japan Aerospace Exploration Agency

Sumitomo Bakelite Company Limited

Sony Group Corporation

Seiko Instruments Inc

Yuichi Ishida

Rikio Yokota

Masahiko Miyauchi

Toshio Ogasawara

Takefumi Furuta

Takashi Enoki

Yoshio Furukawa

Nobuhiro Higashida

Yoshinori Sato

Norimitsu Sanbongi

Noriyoshi Shoji

Nobuyuki Nagai

Yoshio Goto

Takeshi Chiba

Yoshiaki Saita

Osamu Takizawa

Hidenori Saito

Kazuhiko Miyahara

Michiko Nakao

Masako Okanuma

Yoko Hase

Taiki Sugiyama

[Solution] The present invention provides an amide acid oligomer which has specific composition and which is capable of providing a cured product having excellent physical properties, in particular, an excellent glass transition temperature, etc.

Polyamic acid having specific composition, varnish, cured product, and composite material

A gas detection method according to an embodiment of the present technology includes heating a semiconductor sensor that includes an absorption layer that includes a metal oxide; measuring a resistance value of the semiconductor sensor in an air atmosphere in which there exists a reducing gas; and determining that the reducing gas includes a detection-target substance when the measured resistance value is larger than another resistance value in a first temperature range, and when the measured resistance value is smaller than the other resistance value in a second temperature range in which a temperature is higher than a temperature in the first temperature range, the other resistance value being a resistance value of the semiconductor sensor in an air atmosphere in which there exists no reducing gas.

Gas detection method and information processing apparatus

An object of the present invention is to reduce or eliminate a defect (e.g., a void) by achieving (i) a semipreg and a prepreg each of which allows a reduction in residual volatile component and (ii) methods for producing the semipreg and the prepreg, respectively, and consequently to achieve (iii) a fiber-reinforced composite material which has high heat resistance and superior mechanical strength and a (iv) a method for producing the fiber-reinforced composite material. The present invention attains the above object by providing, for example, a semipreg containing: powders of an imide oligomer; and reinforcement fibers, the imide oligomer being represented by a specific general formula (1).

Semipreg, prepreg, resin composite material, and production methods thereof

An imide resin composition including a terminal-modified imide oligomer of General Formula (1) and a thermoplastic aromatic polyimide of General Formula (2). (In Formula (1), either Ror Rshows a phenyl group and the other shows a hydrogen atom; Rand Rshow a divalent residue of aromatic diamine; Rand Rshow a tetravalent residue of aromatic tetracarboxylic acid; m and n satisfy relationships of m&#x2265;1, n&#x2265;0, 1&#x2264;m+n&#x2264;20, and 0.05&#x2264;m/(m+n)&#x2264;1; and an arrangement of repeating units may be either a block or random.) (In Formula (2), Rand Rshow a divalent residue of aromatic diamine; Rshows a tetravalent residue of aromatic tetracarboxylic acid; m and n satisfy relationships of m&#x2265;1 and n&#x2265;0, and an arrangement of repeating units may be either a block or random.)

Polyimide resin composition and varnish produced from terminal-modified imide oligomer prepared using 2-phenyl-4,4'-diaminodiphenyl ether and thermoplastic aromatic polyimide prepared using oxydiphthalic acid, polyimide resin composition molded article and prepreg having excellent heat resistance and mechanical characteristic, and fiber-reinforced composite material thereof

A terminally modified imide oligomer is represented by a specific formula including a 2-phenyl-4,4'-diaminodiphenylether residue or a 4-phenoxy-1,3-diaminobenzene residue. A varnish is obtained by dissolving the terminally modified imide oligomer. A cured product is obtained by heat-curing the terminally modified imide oligomer, and a film including the cured product has a tensile elongation at break of 10% or more. An imide prepreg is obtained by impregnating fibers with the varnish and then drying the impregnated fibers. A fiber-reinforced composite material is obtained by layering and then heat-curing the imide prepreg.

Terminally modified imide oligomer, varnish, cured products thereof, film, and imide prepreg and fiber-reinforced composite material using these

Provided is a varnish including 1 to 500 parts by weight of an aromatic tetracarboxylic acid diester (A) represented by General Formula (1), 1 to 450 parts by weight of 2-phenyl-4,4'-diaminodiphenyl ether (B), 1 to 100 parts by weight of a 4-(2-phenylethynyl)phthalic acid monoester (C) represented by General Formula (2), and 100 parts by weight of an organic solvent having a boiling point of 150&#xb0; C. or less at 1 atmosphere or a mixture of two or more of the organic solvents (D). The components (A), (B), and (C) are dissolved in the varnish. (In the formula, Ris an aromatic tetracarboxylic acid diester residue; Rand Rare the same or different and are an aliphatic organic group or an aromatic organic group.) (In the formula, Rand Rare a hydrogen atom, an aliphatic organic group, or an aromatic organic group).

Varnish including 2-phenyl-4,4'-diaminodiphenyl ether, imide resin composition having excellent moldability, cured resin molded article having excellent breaking elongation, prepreg thereof, imide prepreg thereof, and fiber-reinforced material thereof having high heat resistance and excellent mechanical strength

An imide resin composition including a terminal-modified imide oligomer of General Formula (1) and a thermoplastic aromatic polyimide of General Formula (2). (In Formula (1), either Ror Rshows a phenyl group and the other shows a hydrogen atom; Rand Rshow a divalent residue of aromatic diamine; Rand Rshow a tetravalent residue of aromatic tetracarboxylic acid; m and n satisfy relationships of m&#x2265;1, n&#x2265;0, 1&#x2264;m+n&#x2264;20, and 0.05&#x2264;m/(m+n)&#x2264;1; and an arrangement of repeating units may be either a block or random.) (In Formula (2), Rand Rshow a divalent residue of aromatic diamine; Rshows a tetravalent residue of aromatic tetracarboxylic acid; m and n satisfy relationships of m&#x2265;1 and n&#x2265;0, and an arrangement of repeating units may be either a block or random).

A novel resin-transfer-moldable terminal-modified imide oligomer having a residue of a tetravalent aromatic tetracarboxylic acid and represented by general formula (1), and the imide oligomer contains an oligomer where n is 0 in an amount of 10% by mole or more. In the formula, Rand Rare a hydrogen atom or an aromatic hydrocarbon group having 6 to 10 carbon atoms, and one of Rand Ris the aromatic hydrocarbon group having 6 to 10 carbon atoms; Ris an aromatic organic group surrounded by four carbonyl groups in the aromatic tetracarboxylic acid, and for a formula where n is 2 or more, Rs are optionally the same as or different from each other; and n is an integer of 0 or more and 6 or less.

Resin-transfer-moldable terminal-modified imide oligomer using 2-phenyl-4,4'diaminodiphenyl ether and having excellent moldability, mixture thereof, varnish containing same, and cured resin thereof and fiber-reinforced cured resin thereof made by resin transfer molding and having excellent heat resistance

A novel terminally modified imide oligomer having excellent solubility in organic solvents, excellent solution storage stability, and excellent molding properties such as low melt viscosity. Also, a varnish obtained by dissolving the terminally modified imide oligomer in an organic solvent; a cure product obtained by using the terminally modified imide oligomer and having excellent thermal and mechanical characteristics such as heat resistance, elastic modulus, tensile strength at break and tensile elongation at break; a prepreg; and a fiber-reinforced laminate. The soluble terminally modified imide oligomer is represented by general formula (1). In the formula, Rand Reach represents a divalent aromatic diamine residue; Rand Reach represents a tetravalent aromatic tetracarboxylic acid residue; Rand Reach represents a hydrogen atom or a phenyl group, with Ror Rbeing a phenyl group; m and n satisfy the following relations: m&#x2267;1, n&#x2267;0, 1&#x2266;m+n&#x2266;20 and 0.05&#x2266;m/(m+n)&#x2266;1; and the repeating units may be arranged in blocks or randomly. 

Soluble terminally modified imide oligomer using 2-phenyl-4, 4'-diaminodiphenyl ether, varnish, cured product thereof, imide prepreg thereof, and fiber-reinforced laminate having excellent heat resistance

A material for an insulating film which comprises a copolymer obtained by reacting a polyamide having a specific structure and a reactive oligomer as a component forming the film; a coating varnish for an insulating film which comprises this material and an organic solvent; an insulating film which comprises a layer of a resin comprising as a main structure a polybenzoxazole which is obtained by treating the above material or the above coating varnish by heating so that condensation reaction and crosslinking reaction take place and has fine pores; and a semiconductor device which comprises an insulating interlayer film for multi-layer wiring comprising the insulating film and/or a surface protective film comprising the insulating film. Excellent electrical, thermal and mechanical properties are exhibited and a low permittivity can be achieved.

Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same

A novel aromatic carboxylic acid useful as a material for macromolecular compounds and, in particular, for polycondensed macromolecular compounds exhibiting excellent heat resistance, an acid halide derivative thereof and a process for producing these compounds are disclosed. The aromatic carboxylic acid and the acid halide derivative thereof have structures represented general formulae (1) and (2), respectively, and can be efficiently produced from a dialkyl ester derivative of isophthalic acid and an acetylene derivative in accordance with the disclosed process comprising specific steps.In the above formulae, A represents:&#x2014;C&#x2261;C&#x2014;R&#x2003;&#x2003;(a)or(Rrepresents hydrogen atom, an alkyl group or an aromatic group, Rrepresents an alkyl group or an aromatic group) and X represents a halogen atom.

Aromatic carboxylic acids, acid halides thereof and processes for preparing both

A circuit terminal of a thermal head substrate is connected to a flexible printed circuit by an electroconductive adhesive or a solder metal. An overcoating composed of an insulating or extra-low electroconductive material is applied to cover a region containing a connected portion between the circuit terminal and the flexible printed circuit and to cover an exposed portion of the circuit terminal to thereby prevent corrosion of the circuit terminal, improve the mechanical strength of the flexible printed circuit connection, and prevent a short-circuit.

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Tokyo, Japan

Yuichi Ishida