Kabushiki Kaisha Toshiba

Yuichi Ikedo

Tetsuya Muranaka

Atsushi Takeshita

A photocoupler includes: a light emitting element; a light receiving element; an inner resin layer; and an outer resin layer. The light emitting element is driven by an input electrical signal. The light receiving element is configured to convert emission light of the light emitting element into an electrical signal. The inner resin layer includes a base resin and a curing agent. The base resin contains isocyanuric acid having an epoxy group. The curing agent contains an acid anhydride having an acid anhydride group. The inner resin layer covers the light emitting element and the light receiving element. Then outer resin layer encloses the inner resin layer and configured to block the emission light. Carbon atomic concentration increases and oxygen atomic concentration decreases with distance in depth direction of the inner resin layer from an interface.

Photocoupler

According to one embodiment, a light emitting device includes a first lead, a light emitting element, a second lead and a molded body. The light emitting element is fixed on the first lead. The second lead is provided away from the first lead and electrically connected to the light emitting element via a metal wire. The, molded body made of a sealing resin covers the light emitting element, end portions of the first lead and the second lead, the light emitting element being fixed on the end portion of the first read, and the metal wire being bonded on the end portion of the second lead. The first groove is provided between first and second portions in a front surface of the second lead, the first portion being in contact with an outer edge of the molded body and the metal wire being bonded on the second portion.

Growing community of inventors

Kanazawa Ishikawa, Japan

Yuichi Ikedo