Murata Manufacturing Co., Ltd.

Yuichi Iida

Masahiro Kubota

Kazuo Kishida

Yoshitaka Matsuki

Yusuke Otsuka

Hiraku Kawai

Hiromitsu Ito

Kenji Nishiyama

Osamu Chikagawa

Takaya Wada

Noboru Shiokawa

Rikiya Sano

Takahiro Takada

Seiji Fujita

Tadashi Washimori

Chiharu Sakaki

Isamu Utsunomiya

Fumihiko Naruse

An inductor component comprising a single-layer glass plate of a rectangular parallelepiped shape with a width, a length longer than the width, and a height, and having a bottom surface defined by the length and width and a top surface positioned on a back side of the bottom surface; bottom-surface and top-surface conductors disposed above the bottom and top surfaces, respectively; through wirings each extending through a corresponding one of through holes formed in the glass plate; an underlying insulation layer above the bottom-surface conductors; and first and second terminal electrodes above the underlying insulation layer. The bottom-surface and top-surface conductors, and the through wirings are electrically connected as a circularly extending wiring that circularly extends around a winding axis parallel to the bottom surface and the length. The circularly extending wiring, and the first and second terminal electrodes, are electrically connected to each other as an inductor element.

Inductor component

An electronic component includes a glass substrate having a glass body and a protruding crystallized portion, the glass body including a top surface, a bottom surface, and a first side surface connecting the bottom surface and the top surface to each other, and the first side surface having the crystallized portion; a colored insulation layer on the first side surface; and a through-conductor within the glass body and extending through the top surface and the bottom surface. The crystallized portion extends in a first direction that is parallel to the bottom surface, as viewed from a direction orthogonal to the first side surface. As viewed from the direction orthogonal to the first side surface, at least a portion of the colored insulation layer extends in the first direction and is disposed adjacent to the crystallized portion in a second direction that is orthogonal to the first direction.

Electronic component and manufacturing method thereof

An electronic component comprising a glass body containing a photosensitizer; a conductor as at least a part of an electric element, arranged on the glass body; a terminal electrode as a terminal of the electric element, arranged above an outer surface of the glass body, with the terminal electrode being electrically connected to the conductor; and an insulating film arranged above the outer surface of the glass body. The insulating film reflects or absorbs light in a photosensitive wavelength range of the photosensitizer contained in the glass body.

Electronic component and electronic component module

An electronic component includes a single-layer glass plate, an outer-surface conductor that is disposed above an outer surface of the single-layer glass plate and that is at least a part of an electrical element, and a terminal electrode that is a terminal of the electrical element. The terminal electrode is disposed above the outer surface of the single-layer glass plate and being electrically connected to the outer-surface conductor.

Electronic component, electronic-component mounting board, and electronic-component manufacturing method

A composition for ceramic substrates that includes a mixture of borosilicate glass powder and ceramic powder. The borosilicate glass powder contains 4% to 8% by weight BO, 38% to 44% by weight SiO, 3% to 10% by weight AlO, and 40% to 48% by weight MO, where MO is at least one selected from CaO, MgO, and BaO. The mixing proportions of the borosilicate glass powder and the ceramic powder are 50% to 56% by weight the borosilicate glass powder and 50% to 44% by weight the ceramic powder. The ceramic powder has an average particle diameter D50 of 0.4 to 1.5 &#x3bc;m.

Composition for ceramic substrates and ceramic circuit component

When a multilayer ceramic substrate with a cavity is reduced in thickness, a bottom wall portion defining the bottom of the cavity is reduced in thickness, thereby leading to the problem that the bottom wall portion is likely to be broken. A bottom wall portion defining a cavity of a multilayer ceramic substrate has a stack structure formed with a high thermal expansion coefficient layer sandwiched between first and second low thermal expansion coefficient layers. This configuration generates compression stress in the low thermal expansion coefficient layers during a cooling process after firing, thereby allowing the mechanical strength at the bottom wall portion to be improved.

Multilayer ceramic substrate and method for producing the same

A multilayer ceramic substrate includes a ceramic laminated body including a plurality of ceramic layers stacked on each other, a resistor, and a resistor connecting conductor with a portion overlapping the resistor and an overcoat layer that covers the resistor located on a principal surface of the ceramic laminated body. An overcoat layer is made relatively thick during firing, thereby making cracks less likely to be caused, and after the firing step, the thickness of the overcoat layer is reduced by physically scraping down the surface of the overcoat layer, thereby reducing the trimming time. In the overcoat layer, a region that covers a portion in which a resistor overlaps a resistor connecting conductor is thicker than a region that covers the other portion.

A laminate type ceramic electronic component includes a thick film resistor and an overcoat layer so as to prevent defects such as delamination from being caused and to prevent the thick film resistor from being cracked after laser trimming, even when a method is adopted in which an unfired composite laminate is subjected to firing in such a way that an unfired ceramic laminate, an unfired thick film resistor, and an unfired overcoat layer are each integrally sintered. The unfired overcoat layer includes a glass ceramic material containing a ceramic and glass having substantially the same constituents and compositional ratio as those of the glass contained in the unfired ceramic layer. The respective glass ceramic materials constituting the unfired ceramic layer and the unfired overcoat layer are adjusted so that the ratio of a crystalline phase with a smaller coefficient of thermal expansion than the coefficient of thermal expansion of the fired ceramic layer is higher in the overcoat layer than in the ceramic layer.

Laminate type ceramic electronic component and method for manufacturing same

A laminate includes base material layers and interlayer constraining layers disposed therebetween. The base material layers are formed of a sintered body of a first powder including a glass material and a first ceramic material, and the interlayer constraining layer includes a second powder including a second ceramic material that will not be sintered at a temperature for melting the glass material, and is in such a state that the second powder adheres together by diffusion or flow of a portion of the first powder including the glass material included in the base material layer at the time of baking. The incorporated element is in such a state that an entire periphery thereof is covered with the interlayer constraining layer.

Multilayer ceramic substrate and method for manufacturing the same

In a multilayer ceramic substrate having a cavity, base-material layers are arranged on a base side with respect to an interface between the base and a wall defining a cavity, and a constraining interlayer is arranged on the wall side. A conductive film is arranged between the base-material layers and the constraining interlayer, the base-material layers and the constraining interlayer sandwiching the interface. The effect of the first conductive film results in an increase in the adhesion of the constraining interlayer to the substrate layers, thus enhancing a shrinkage-inhibiting effect of the constraining interlayer.

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Nagaokakyo, Japan

Yuichi Iida