Shinko Electric Industries Co., Ltd.

Yuichi Hata

Norio Shiraiwa

Naoto Watanabe

Takeshi Kobayashi

A disclosed substrate temperature adjusting-fixing device includes an electro static chuck attracting and holding an attractable object onto a base body having a built-in electrode by applying a voltage to the electrode, a base plate fixing the electro static chuck via an adhesive layer, a power supplying portion electrically connected to the electrode, and a retaining portion holding the power supplying portion, wherein the retaining portion includes a main body and a sealing portion, the main body is fixed to the base plate and has recesses opened on an opposite side of the adhesive layer and a through hole penetrating through the main body, the power supplying portion includes an electrode pin and an electric wire, the electric wire is wired inside the adhesive layer, the through hole and the recesses to electrically connect the electrode with the electrode pin, and the sealing portion fills the recesses.

Substrate temperature adjusting-fixing device

In a method of manufacturing an electrostatic chuck, the method includes: a step of providing an electrostatic chucking portion including an electrode to which a voltage is applied and a film-like insulating layer covering the electrode; a step of bonding an elastomer layer onto the electrostatic chucking portion; a step of bonding a metal base onto the elastomer layer such that recess portions formed on a surface of the metal base face the elastomer layer.

Electrostatic chuck and method of manufacturing the same

An electrostatic chuck includes a base plate, an electrode layer having flexibility, covering the surface of the base plate, and a power supply unit for electrically connecting the electrode layer to the power source side. The power supply unit includes a connection piece including a wire, and electrically conductive components to be used in connection to the power source side. The wire is connected to an electrode of the electrode layer, and extends from the side edge of the electrode layer. The electrically conductive component is electrically connected with the wire, and fixes the connection piece bent along the side surface of the base plate to the base plate.

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Nagano, Japan

Yuichi Hata