Showa Aluminum Corporation

Showa Denko K.k.

Kabushiki Kaisha Toyota Jidoshokki

Honda Giken Kogyo Kabushiki Kaisha

Visteon Global Technolgoies, Inc.

Kabushiki Kaisha Toshiba Jidoshokki

Showa Denko Kabushiki Kaisha

Yuichi Furukawa

Keiji Toh

Katsufumi Tanaka

Eiji Kono

Shinobu Yamauchi

Shintaro Nakagawa

Kota Otoshi

Nobuhiro Wakabayashi

Ichiro Iwai

Koichiro Fukui

Hidehito Kubo

Masahiko Kimbara

Takashi Iwasa

Tomio Ito

Shinji Okabe

Takushi Irie

Kazunari Noguchi

Mitsugu Sumitani

Ryoichi Hoshino

Yuji Yamamoto

Shoichi Sato

Hirohiko Watanabe

Koichiro Take

Kaoru Hasegawa

Masaaki Munekawa

Saburo Shimodaira

Minoru Hasegawa

Thaddeus J Waskiewicz

Keiichiro Ohta

Chuichi Takahashi

Arif Mujib Khan

Qun Liu

Fumio Shimizu

Hiroyasu Shimanuki

Isamu Uchida

Etsuo Shinmura

A heat sink () for power module is capable of mounting a power device () on at least a surface of the heat sink. The heat sink includes a refrigerant passage () in which cooling medium that dissipates heat generated by the power device () flows and a corrugated fin body () arranged in the refrigerant passage (). The corrugated fin body () has crests () and troughs () that extend in the flow direction of the cooling medium, and side walls () each of which connects the corresponding one of the crests () with the adjacent one of the troughs (). Each adjacent pair of the side walls () and the corresponding one of the crests () or the corresponding one of the troughs () arranged between the adjacent side walls () form a fin (). Each of the side walls () has a louver () that operates to, at least, rotate the cooling medium flowing in the associated fin (). The heat sink () thus has a further improved heat dissipating performance.

Heat sink for power module

A heat sink for a power module able to realize a further improvement of heat radiating performance and a further improvement of a mounting property is provided. The heat sinkfor a power module has a laminating body, a first side plateand a second side plate. The laminating bodyhas plural flow path platesformed in a plate shape in which plural groovesparallel to each other are concavely arranged on a flat joining face. Each grooveis set to a parallel flow pathparallel to a front face side by laminating each flow path plateby each joining face. A portion other than each grooveof each joining faceforms a heat transfer pathto each parallel flow pathof a laminating direction. A flow-in pathand a flow-out pathare formed in the first and second side plates. The flow-in pathand the flow-out pathare joined to side facesof the laminating body, and are communicated with each parallel flow path. The flow-in pathflows a cooling medium into each parallel flow path. The flow-out pathflows the cooling medium out of each parallel flow path. A refrigerant flow path is constructed by the flow-in path, each parallel flow pathand the flow-out path

A heat radiatorincludes an insulating substratewhose first side serves as a heat-generating-element-mounting side, and a heat sinkfixed to a second side of the insulating substrate. A metal layeris formed on the second side of the insulating substrateopposite the heat-generating-element-mounting side. A stress relaxation memberformed of a high-thermal-conduction material intervenes between the metal layerof the insulating substrateand the heat sinkand includes a plate-like bodyand a plurality of projectionsformed at intervals on one side of the plate-like body. The end faces of the projectionsof the stress relaxation memberare brazed to the metal layer, whereas the side of the plate-like bodyon which the projectionsare not formed is brazed to the heat sink. This heat radiatoris low in material cost and exhibits excellent heat radiation performance.

Heat radiator and power module

A semiconductor moduleincludes a ceramic substrate having a front surface on which a semiconductor elementis mounted and a rear surface on the opposite side of the front surface, a front metal platejoined to the front surface, a rear metal platejoined to the rear surface, and a heat sinkjoined to the rear metal plate. The rear metal plateincludes a joint surfacethat faces the heat sink. The joint surfaceincludes a joint area and a non-joint area. The non-joint area includes recesseswhich extend in the thickness direction of the rear metal plate. The joint area of the rear metal plateis in a range from 65% to 85% of the total area of the joint surfaceon the rear metal plate. As a result, excellent heat dissipating performance can be achieved while occurrence of distortion and cracking due to thermal stress is prevented.

Semiconductor module

A refrigeration system including a two-stage type compressor having independent low-pressure and high-pressure compressing portions, a heat-releasing device having independent primary and secondary heat-releasing paths, an expansion valve and a cooler. The refrigerant primarily compressed by the low-pressure compressing portion is primarily released in heat by the primary heat-releasing path. The primarily heat-released refrigerant is secondarily compressed by the high-pressure compressing portion. The secondarily compressed refrigerant is secondarily released in heat by the secondary heat-releasing path to thereby obtain a low-temperature and high-pressure refrigerant. The low-temperature and high-pressure refrigerant is decompressed and expanded by an expansion valve and passes through the cooler to absorb the heat in a room air, and then returns to the low-pressure compressing portion of the compressor. In this system, the refrigerant temperature during the heat-releasing procedure can be kept low.

Refrigeration system, compressing and heat-releasing apparatus and heat-releasing device

A refrigerant tube for a heat exchanger, comprising: a generally flat tube,having generally flat upper and lower walls,; a plurality of reinforcing walls,connected between the upper and lower walls,, the reinforcing walls extending along and generally parallel with a longitudinal axis A&mdash;A of the tube and being spaced apart from one another by a predetermined distance; and a plurality of communication holes,distributed along the length of each reinforcing wall,, thereby defining a plurality of discrete wall portions,along each reinforcing wall,, each of the discrete wall portions,being disposed between adjacent communication holes,and having an upstream edge,and a downstream edge,thereof, the communication holes,and discrete wall portions,having lengths L,and L,, respectively, as measured along the longitudinal axis A&mdash;A, the communication holes,being spaced apart along each reinforcing wall,by a pitch P. Each communication hole,in each reinforcing wall is disposed between the upstream and downstream edges,of a laterally adjacent discrete wall portion,of each adjacent reinforcing wall, such that a wall overlap ratio Wr, defined as &lsqb;P&minus;2L,&rsqb;/P, is greater than 0, and preferably 0.4&lE;Wr&lE;0.6.

Refrigerant tube for a heat exchanger

A heat sink for use in a portable electronic device for disposing of the heat generated by an electronic component of the device, the heat sink comprising in its entirety a metal clad plate composed of two metal sheets and having a nonbonded portion in a required pattern, the nonbonded portion providing a heat pipe portion formed by outwardly inflating at least one of the two metal sheets of the nonbonded portion to make a hollow portion and enclosing a working liquid in the hollow portion, the metal clad plate having on one surface thereof a mount portion for the electronic component at a region thereof where the heat pipe portion is partly present, the heat pipe portion having a heat receiving portion at the region thereof where the mount portion is present. When a heat-generating electronic component is attached to the mount portion, the working liquid in the heat receiving portion is heated with the heat produced by the component to evaporate. The resulting gas flows toward other portion, where the gas releases heat through the clad plate and liquefies. The working liquid thus liquefied again returns to the heat receiving portion. The liquid remaining at locations other than the heat receiving portion flows into the heat receiving portion. This operation is repeated to dispose of the heat produced by the component.

Heat sink for portable electronic devices

A heat sink device for use in an electronic device for dissipating into the atmosphere outside a housing of the electronic device the heat generated by an electronic component disposed within the housing. The housing has a peripheral wall formed with a heat removal opening. A heat sink disposed within the housing comprises a metal body having a heat pipe portion, and a radiation fin attached to the body in the vicinity of the heat removal opening and opposed to the opening. The heat-generating electronic component, such as CPU, is held in contact with the metal body at a location away from the fin attached portion thereof.

Heat sink device for electronic devices

An aluminum weldment is produced by resistance-welding aluminum workpieces, and has a nugget formed between the aluminum workpieces which contains more magnesium than the base material of the aluminum workpieces. The nugget contains 5.about.17 wt % of magnesium which forms a solid solution with aluminum.

Aluminum weldment and method of welding aluminum workpieces

Workpieces of aluminum alloy are resistance-welded while a powdery mixture of magnesium and a metal oxide is being interposed between regions of workpieces of aluminum alloy which are to be joined to each other. The metal oxide may comprise at least one material selected from the group consisting of TiO.sub.2, SiO.sub.2, Cr.sub.2 O.sub.3, MnO.sub.2, Fe.sub.2 O.sub.3, CuO, and Ti.sub.2 O.sub.3 and the powdery mixture may include aluminum powder. The workpieces may be made of aluminum, stainless steel, or the like rather than aluminum alloy.

Method of resistance-welding workpieces of metal and resistance-welded

In a method of hot brazing aluminum articles, the steps of: interposing an amount of a flux-containing brazing agent (12) between portions of aluminum articles (11, 11) which are to be adjoined one to another; gripping the portions with a pair of heaters (13); and then activating the heater so that heat conducted therefrom melts the brazing agent (12) to braze the aluminum articles (11), are carried out in this order. The brazing agent (12) is a compacted agent composed of a matrix powder and a flux powder, at a ratio in weight of 99.9:0.1 to 70:30, and the agent has a density corresponding to 90% or more of a theoretical value. The articles (11) may be pressed one to another towards adjoining surfaces while they are being heated by the heater (13), or the heaters (13) are slided relative to the adjoining portions so that they are heated wholly, or the adjoining articles (11, 11) are urged towards each other while the heaters (13) are being slided relative to them so as to entirely heat them, so that the brazing is carried out efficiently to manufacture brazed products which are of a higher brazing strength.

Method of hot brazing aluminum articles

In a heat pipe container having a working fluid enclosed therein, the container includes a container body in the form of a horizontal straight tube and having an evaporator portion, a heat insulating portion and a condenser portion as arranged from one end of the body to the other end thereof, and an upward hollow projecting portion provided on the condenser portion of the container body.

Heat pipe

A heat pipe comprising a container having water enclosed therein as a working fluid and made of a material reactive with water to evolve hydrogen gas. The heat pipe is characterized in that the container has placed therein a solid oxidizing agent for oxidizing the hydrogen gas to water. The hydrogen gas produced by the reaction of the working fluid, i.e. water, with the container is oxidized to water by the oxidizing agent without remaining in the form of a gas within the condensing portion of the pipe.

A process for producing a heat pipe including the steps of treating the inner surface of a steel container with an aqueous solution of a vanadate with heating, and enclosing in the container a working liquid prepared by adding an alkalinizing pH adjusting agent to pure water and having an adjusted pH of 8 to 12. When the container inner surface is treated with the aqueous vanadate solution with heating, a protective layer covering the inner surface is formed. The working liquid, when in the range of 8 to 12 in pH, maintains the protective layer in a stable state over a prolonged period of time.

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Oyama, Japan

Yuichi Furukawa