Omron Corporation

Yui Tada

Shinji Nakamura

Shinichiro Okamura

Yoichi Toguchi

Syuichi Sugimoto

Motonari Fujikawa

Provided are an intruding object detecting apparatus (a radio wave sensor) capable of setting an arbitrary detection region, an apparatus for setting the detection region and a setting processe. An intruding object detecting apparatusis installed in a corner of a room, a coordinate system is defined in which a location of the intruding object detecting apparatusis an origin thereof, and coordinates are a distance r from the intruding object detecting apparatus and a scanning angle &#x3b8; of a transmission antenna/reception antenna of the intruding object detecting apparatus, and a state corresponding to the coordinate system is stored (b) in a storage means; thereby enabling the detection regionof the intruding object detecting apparatus can be arbitrarily set. Moreover, the setting can be performed with ease using a reflector or a transmitter, or alternatively, using a setting apparatus constituted of the reflector and the transmitter, combined.

Intruding object detecting apparatus, and setting apparatus, setting process and setting confirmation process therefor

A method for manufacturing an electronic component by seal-molding with resin a die pad mounted by an electronic element thereon and loads of input-and-output terminals which are supported by a lead frame having an outer frame and removing such sealed electronic component with mold materials from the outer frame of the lead frame which includes suspending pins for supporting the leads and a first mold holder disconnected from the leads, the method including the steps of resin molding a first mold member on the leads and the first mold holder to join the leads and the first mold member with the first mold member, cutting the suspending pins between the first mold member and the outer frame, resin-molding a second mold member on the first mold member to cover the cut ends of the suspending pins, and cutting the first mold holder between the second mold member and the outer frame to remove thus molded electronic component from the lead frame.

Growing community of inventors

Kyoto, Japan

Yui Tada