Asm Assembly Automation Limited

Yui Ko Wong

Chi Wah Cheng

Yiu Ming Cheung

Hoi Fung Tsang

Tim Wai Mak

The invention provides an apparatus and method for cleaning a plurality of electronic components. A tank is provided for containing a cleaning fluid and an ultrasonic resonator is mounted in communication with the cleaning fluid for charging ultrasonic energy thereto. A support platform positionable over a top surface of the cleaning fluid supports the electronic components such that the electronic components are in contact with said top surface of the cleaning fluid in use. Further, a cleaning fluid supply system is configured to generate a continuous flow of cleaning fluid into the tank for cleaning the electronic components in contact with said top surface of the cleaning fluid.

Apparatus and method for cleaning electronic packages

Packages of varying dimensions are loaded into a plurality of electrical package tubes. A guide arrangement is provided, which is programmable to receive the electrical packages by automatically configuring to accommodate the varying dimensions of the electrical packages, the configuring being performed without manual intervention, and a receiving arrangement is provided to receive the electrical package tubes and configured to individually align the electrical package tubes with the guide arrangement to receive the electrical packages. Upon application of a feeding force to the electrical packages, the guide arrangement guides the electrical packages into the electrical package tubes.

Growing community of inventors

Hong Kong, China

Yui Ko Wong