Macronix International Co., Ltd.

Yuhturng Liu

Kuang-Chao Chen

Hsueh-Hao Shih

Yung-Tai Hung

Chi-Tung Huang

A chemical mechanical polishing to polish a substrate having a layer to be polished thereon is described. A pre-polishing process is performed using a softer polishing pad to remove partially raised parts of the layer to be polished before conducting a polishing process using a harder polishing pad. Since the first polishing pad is flexible, porous and with low density, the first polishing pad can be deformed to increase contact areas between the first polishing pad and the raised part of the layer to be polished, and the abrasives are embedded easily in holes of the surface of the first polishing pad. Ultimately, the layer to be polished can be polished directly during the pre-polishing process. Therefore, the processing time is reduced, the consumption of the slurry is decreased and the process cost can be cut down substantially.

Polishing pad and process of chemical mechanical use thereof

A method of fabricating a shallow trench isolation structure. A pad oxide layer, a mask layer, a dielectric anti-reflection coating layer and a cap oxide layer are formed on a substrate sequentially. A trench is formed in the substrate. A liner oxide layer is formed along a surface of the trench. An isolation layer is formed over the substrate to fill the trench. Using the mask layer as a polishing endpoint, the insulation layer, the dielectric anti-reflection coating layer and the cap oxide layer over the mask layer are removed. The thickness of the mask layer is controlled within a first fixed range, and the thickness of the dielectric anti-reflection coating layer is controlled, within a second fixed range, such that the light source of the optical endpoint detection system can produce a maximum reflected light signal. The mask layer and the pad oxide layer are then removed.

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Kaohsiung, Taiwan

Yuhturng Liu