Seagate Technology Incorporated

Yuhong Xiong

Joel William Hoehn

Andrew D Habermas

Gordon Merle Jones

Jeff O'Konski

Marc Ronshaugen

Ricky Ray Anderson

Andrew Sherve

Kevin Lamber Mayer

Dat Quach

Paul E Gallup

Loh Soo Chun

Joshua Zierhut

Kok Yen Goh

PengKoon Hew

Yeoh Hooi Sze

Hew Peng Koon

Ng Kok Cheong

Ooi Ee Lee

The present disclosure includes a lapping system that includes a temperature control system system to heat or cool the lapping plate while lapping. The temperature control system can include a closed circuit fluid system and/or one or more electrical resistive heating elements. In some embodiments that cooling system can control the temperature of the lapping plate during lapping to within +/&#x2212;5&#xb0; C., or even +/&#x2212;0.5&#xb0; C.

Lapping system that includes a lapping plate temperature control system, and related methods

The present disclosure includes methods and systems for lapping a row bar of sliders. According to the present disclosure, an electrical interconnect configuration is provided that permits the net current provided to a row bar to heat electrical heating devices during lapping to be managed so as help prevent exceeding breakdown currents of related electrical channels.

Methods and systems for providing electrical power to one or more heat sources in one or more sliders while lapping said sliders

An adaptive bending structure or insert for a lapping device is disclosed. In illustrated embodiments the bending structure provides a wider control width between bending nodes for imparting bending to a workpiece for lapping or longer beam length to increase stroke input at outer ends of the bending structure. In illustrated embodiments, outer bending fingers of the bending structure have a wider width than inner bending fingers to provide the wider control width of the adaptive bending structure. The wider bending fingers of the bending structure connect to actuator fingers of an actuator module to adapt the actuator module to provide an increased control width for controlling bow and curvature of the workpiece during the lapping process.

Lapping device or carrier with adaptive bending control

Embodiments of the present disclosure demonstrate a lapping carrier system for a bar to be lapped. The lapping carrier system may be configured with a single piece insert whose bridge is separated from a plurality of joints of the carrier insert by a varying distance. The varying distance can be greater at a medial portion of the bridge than at an end portion of the bridge to collectively form a parabolic shape. In some embodiments, a lapping insert can include a bridge with its length longer than the bar. In some embodiments in a lapping insert, the centerline between the end joint edge and the end finger edge extends beyond the edge of bar.

Lapping carrier system with optimized carrier insert

Embodiments of the present disclosure include carriers for a row bar or stack of row bars to be lapped. In some embodiments, the ratio of the coefficient of thermal expansion of at least the bridge of a carrier to the coefficient of thermal expansion of the slider row bar or stack of slider row bars is less than 1.6. In some embodiments, a carrier can include a bridge having a length longer than the row bar or stack of row bars. In some embodiments, one or more bridge bending members can have junction centerlines offset from the corresponding bridge bending members.

Carrier for mounting a bar of sliders or a stack of such bars to be lapped

One or more slider bars are attached to at least one component of a multi-component carrier device. The multi-component carrier device is attached to a lapping arm of a lapping machine and the one or more slider bars attached to the carrier device are lapped. The at least one component of the multi-component carrier device is attached to a grinding/cutting machine. At least one of a grinding operation or a cutting operation is performed on the one or more slider bars.

Method and assembly for grinding and/or cutting a slider bar on a lapping carrier

An assembly includes a carrier device having proximal and distal ends. The carrier device includes a workpiece platform along the proximal end. The workpiece platform supports one or more slider bars. The carrier device attaches to a lapping machine. An adaptive component, including at least one spring, has a first portion that couples to the carrier device and a second portion that couples to a grinding-slicing machine.

Growing community of inventors

Maple Grove, MN, United States of America

Yuhong Xiong