Canon Kabushiki Kaisha

Yuhei Sumiyoshi

Masayuki A Suzuki

Daisuke Kobayashi

Koji Mikami

Noritoshi Sakamoto

Bunsuke Takeshita

Hiroyuki Yuuki

Takumi Tokimitsu

An exposure apparatus that exposes a substrate to light by using an original in which a pattern is formed includes an illumination optical system arranged to guide illumination light to the original, the illumination light including first illumination light with a first wavelength and second illumination light with a second wavelength different from the first wavelength, and a projection optical system arranged to form a pattern image of the original by using the illumination light at a plurality of positions in an optical axis direction. The illumination optical system is configured to adjust a position deviation in a direction perpendicular to the optical axis direction between a pattern image formed by the first illumination light and a pattern image formed by the second illumination light by changing an incident angle of the illumination light entering the original.

Exposure apparatus, exposure method, and manufacturing method for product

The present invention provides an exposure apparatus that exposes a substrate via an original, including an illumination optical system configured to illuminate the original, and a projection optical system configured to project a pattern of the original onto the substrate, wherein the illumination optical system illuminates the original by illumination light which includes a first portion that enters an incident pupil of the projection optical system and a second portion which enters a region outside the incident pupil, and the first portion and the second portion are separated from each other on an incident pupil plane of the projection optical system.

Exposure apparatus, exposure method, and method of manufacturing article

An evaluation method for evaluating an aberration of a projection optical system in an exposure apparatus is provided. A first prediction coefficient of a first prediction formula for an aberration that is symmetrical with respect to an optical axis of the projection optical system is obtained, and a second prediction coefficient of a second prediction formula for an aberration that is asymmetrical with respect to the optical axis of the projection optical system is obtained. The aberration of the projection optical system is evaluated using the first prediction coefficient in a case where the shape of the illuminated region is determined as symmetrical with respect to the optical axis, and the aberration of the projection optical system is evaluated using the first and the second prediction coefficients in a case where the shape of the illuminated region is asymmetrical with respect to the optical axis.

Evaluation method, exposure method, and method for manufacturing an article

A distortion detection method includes obtaining a positional deviation amount expression formula that expresses positional deviation amounts in two directions at each position on a substrate held by a chuck, based on information about a warping shape of the substrate in a state where the substrate is not yet held by the chuck, calculating positional deviation amounts in two directions at a plurality of positions on the substrate based on the obtained positional deviation amount expression formula, and obtaining a plurality of types of distortion components relating to a shot region of the substrate based on the positional deviation amounts in two directions obtained at the plurality of positions.

Distortion detection method, exposure apparatus, exposure method, and device manufacturing method

A projection optical system of the present invention includes an optical element group that includes optical elements, and a controller that drives at least one of the first optical elements. The optical element group includes aspheric surfaces having a complementary relationship with each other and are arranged so that the aspheric surfaces face each other. The controller changes a relative position between the optical elements in a first direction and a second direction orthogonal to the first direction to control optical performances of the projection optical system corresponding to each of the first direction and the second direction.

Projection optical system, exposure apparatus and device manufacturing method

A projection optical system is configured to project an image of an object plane onto an image plane, and includes a first optical element having an aspheric shape that is rotationally asymmetric with respect to an optical axis, a moving unit configured to move the first optical element in a direction perpendicular to the optical axis, and a second optical element fixed on the optical axis, and configured to reduce an optical path length difference caused by an aspheric surface of the first optical element, the second optical element having no aspheric shape complement to the aspheric shape of the first optical element.

Projection optical system, exposure apparatus, and device manufacturing method

A detection apparatus which illuminates a sample and detects light reflected by the sample, comprises a light source, a columnar reflecting member having a columnar reflecting surface which reflects light having entered a first end of the columnar reflecting member by a plurality of number of times, and emits the light from a second end of the columnar reflecting member, a mirror which reflects light radiated by the light source so as to guide to the first end and a detector, wherein the sample is illuminated with the light emitted from the second end, and the detector is configured to detect the light which has been reflected by the sample and has passed through the columnar reflecting member, and a reflecting surface of the mirror is a concave surface, and a shape of a reflecting surface of the mirror on a section perpendicular to an axis of the columnar reflecting member is concave.

Detection apparatus

An exposure apparatus includes a illumination optical system for illuminating a reticle with light from a light source, and a projection optical system for projecting a pattern of the reticle onto an object, said projection optical system includes a lens closest to the object, wherein a surface on the object side of the lens is smaller than an effective area of a surface on the reticle side of the lens, and wherein said exposure apparatus exposes the object via a liquid that is filled in a space between the lens and the object.

Exposure apparatus

A projection optical system used for an exposure apparatus to projecting a reduced size of an image of an object onto an image plane includes plural refractive elements that dispense with a reflective element having a substantial optical power, wherein the projection optical system forms an intermediate image.

Projection optical system and exposure apparatus having the same

A projection optical system includes an optical element that includes and locally uses a reflective or refractive area that is substantially axially symmetrical around an optical axis, the optical element being rotatable around the optical axis.

Projection optical system, exposure apparatus and method using the same

A projection exposure apparatus having a function for adjusting a projection magnification, a symmetric distortion aberration and another optical characteristic of a projection optical system is disclosed, wherein, when the projection magnification and the symmetric distortion aberration are adjusted, the other optical characteristic of the projection optical system is adjusted so that a change thereof is reduced very small or zero, such that good optical performance of the projection optical system is retained.

Projection exposure apparatus, and device manufacturing method

A projection exposure apparatus usable with a reticle having a pattern and a wafer onto which the pattern of the reticle is transferred. The apparatus includes an illumination system for illuminating the reticle, a projection optical system for projecting the pattern of the reticle onto the wafer, wherein the projection optical system includes two lens groups which are individually movable along an optical axis direction, but are not juxtaposed with each other, and a controller for simultaneously adjusting distortion and projection magnification of the pattern projected onto the wafer. The controller performs the adjustment such that the two lens groups of the projection optical system are moved separately along the optical axis direction.

Growing community of inventors

Utsunomiya, Japan

Yuhei Sumiyoshi