Fuji Electric Co., Ltd.

Dowa Metaltech Co., Ltd.

Yuhei Nishida

Tatsuo Nishizawa

Eiji Mochizuki

Fumihiko Momose

Kyohei Fukuda

Masanori Tanaka

Takashi Ideno

Yukihiro Kitamura

A semiconductor device has a resistance element including a metal block, a resin layer disposed on the metal block, and a resistance film disposed on the resin layer and an insulated circuit board including an insulating plate and a circuit pattern disposed on the insulating plate and having a bonding area on a front surface thereof to which a back surface of the metal block of the resistance element is bonded. The area of the circuit pattern is larger in plan view than that of a front surface of the resistance element. The metal block has a thickness greater than that of the circuit pattern in a direction orthogonal to the back surface of the metal block. As a result, the metal block properly conducts heat generated by the resistance film of the resistance element to the circuit pattern.

Semiconductor device

Provided are a semiconductor module in which bonding properties between an insulated substrate and a sealing resin is improved and a method for manufacturing the semiconductor module. A semiconductor moduleis provided with: an insulated substrate; a circuit patternthat is formed on the insulated substrate; semiconductor elementsthat are joined on the circuit pattern; and a sealing resinfor sealing the insulated substrate, the circuit pattern, and the semiconductor elements. The surfaceof the insulated substrate in a part where the insulative substrate and the sealing resin are bonded to each other, is characterized in that, in a cross section of the insulated substrate, the average roughness derived in a 300-&#x3bc;m wide range is 0.15 &#x3bc;m or greater and the average roughness derived in a 3-&#x3bc;m-wide range is 0.02 &#x3bc;m or greater.

Semiconductor module and method for manufacturing same

A semiconductor device includes: a first insulating circuit substrate; a first semiconductor chip mounted on a top surface of the first insulating circuit substrate; a printed circuit board arranged over the first insulating circuit substrate; a first external terminal inserted to the printed circuit board and having one end bonded to the top surface of the first insulating circuit substrate; and a first pin inserted to the printed circuit board and having one end bonded to a top surface of the first semiconductor chip, wherein the first insulating circuit substrate and the printed circuit board having warps complimentary to each other.

Semiconductor device, semiconductor manufacturing apparatus and method of manufacturing semiconductor device having printed circuit board and insulating board with complementary warps

A semiconductor module includes block-shaped first and second lower base members provided by bonding of flat lower surfaces on an insulated circuit board and having bottomed first and second hole portions open in upper surfaces in upper portions of the first and second lower base members, tubular first and second upper slide support members inserted in the first and second hole portions in a state where at least a part of outside surfaces is in contact with inside walls of the first and second hole portions, first and second pins inserted in contact with the insides of the first and second upper slide support members, and a sealing resin sealing the first and second pins except for the upper portions of the first and second pins.

Semiconductor module and semiconductor module manufacturing method

A semiconductor module includes a metal plate; a solder applied on the metal plate; a component-to-be-bonded mounted on the solder; and a linear guide portion delineated along a circumference of the component-to-be-bonded on a top surface of the metal plate, and including a metal surface having greater surface roughness than a peripheral region.

Semiconductor module and method for manufacturing semiconductor module

A semiconductor device according to the invention includes an insulating substrate including an insulating plate, a circuit pattern that is formed on a front surface of the insulating plate, and a radiator plate that is fixed to a rear surface of the insulating plate, a semiconductor chip that is fixed to the circuit pattern, an external lead terminal that is connected to a surface electrode of the semiconductor chip through a wiring line, a molding resin that covers the insulating substrate, the semiconductor chip, the wiring line, and the external lead terminal such that a rear surface of the radiator plate and a portion of the external lead terminal are exposed, and an anchor layer including a stripe-shaped concave portion which is formed in the circuit pattern by laser beam irradiation.

A semiconductor device is fastened to a heat dissipation member such that a force directed downward acts from a metal substrate onto the heat dissipation member, with a rim portion of a storage region as a fulcrum with respect to the heat dissipation member. As a result, a heat conductive material can be spread into a thinner layer between the metal substrate and the heat dissipation member, improving the heat dissipation between the metal substrate and the heat dissipation member.

Semiconductor device, method for installing heat dissipation member to semiconductor device, and a method for producing semiconductor device

A semiconductor device includes a frame including a first step portion provided in a ring shape in an inner circumference of one main surface of the frame, a second step portion provided in a ring shape in an inner circumference of another main surface of the frame, and an inner wall provided between the first step portion and the second step portion; a terminal leading from the first step portion to outside; a circuit board fitted to the second step portion; and an adhesive resin bonding the second step portion and the circuit board, and contacting the inner wall and the terminal.

Growing community of inventors

Matsumoto, Japan

Yuhei Nishida