Kyocera Corporation

Yuhei Matsumoto

Youji Furukubo

Masanori Okamoto

Sentarou Yamamoto

Sentaro Yamamoto

Kazuki Nishimoto

Kouichirou Sugai

Kazuhiro Okamoto

A joint body of the present disclosure includes a substrate including a base member having insulating properties and a metal layer positioned on a first main surface of the base member, a metal joint layer, and a metal member. The metal joint layer is positioned between the metal layer and the metal member of the substrate. The metal joint layer includes a nickel layer, a solder layer, and a composite layer containing a mix of nickel and solder. The nickel layer, the composite layer, and the solder layer are positioned in this order from the metal layer side to the metal member side. The nickel in the composite layer extends from the nickel layer in the thickness direction and forms protrusions and recesses.

Joint body and light source device

The present invention includes: a substrate, a rectangular frame-shaped substrate bank sectionprovided on the substrateand including four corner portionsA, and a metal layerprovided on a top surfaceAa of the substrate bank section. A top surfaceAa of the corner portionsA of the substrate bank sectionmay have an inclined portion S slanted downward. An electronic component housing package may have a lid welded onto the metal layerprovided on the substrate bank sectionof the electronic component storage substrate.

Electronic component storage substrate and housing package

Growing community of inventors

Kirishima, Japan

Yuhei Matsumoto