Taiwan Semiconductor Manufacturing Comp. Ltd.

Yuh-Sen Chang

Shih-Yen Chen

Tzi-Yi Shieh

Chung-Li Lee

Mirng-Ji Lii

Yung-Sung Yen

Wei-Chih Chen

Chin-Yu Ku

Sheng-Yu Wu

Hon-Lin Huang

Kuei Shun Chen

Ming-Tan Lee

Ching-Hui Chen

Wen-Ming Chen

Hsiao-Tzu Lu

Chien-Hung Kuo

Chih-Yuan Chiu

Yi-Ting Hu

Pin-Yi Shin

Shang-Hsien Lin

Chih-Yang Chan

Szu-Hsien Lee

Chia-Haw Yeh

Chia-Sui Hsu

Pei-Shan Wu

Yu-Lin Wang

A tool and a method of reflow are provided. In various embodiments, the tool includes a chamber unit, a wafer lifting system, a heater, and an exhausting unit. The wafer lifting system is disposed in the chamber unit. The heater is coupled to the chamber unit, and configured to heat the wafer. The exhausting unit coupled to the chamber unit, and configured to exhaust gas in the chamber unit. The wafer lifting system is configured to receive and move the wafer in the chamber unit, and to provide a vertical distance between the heater and the wafer in the chamber unit.

Tool and method of reflow

A bonding apparatus includes a wafer stage, a first chip stage, a first chip transporting device, a second stage and a second chip transporting device. The wafer stage is used for holding a wafer. The first chip stage is used for holding at least one first chip. The first chip transporting device is used for transporting the first chip from the first chip stage onto the wafer. The second chip stage is used for holding at least one second chip. The second chip transporting device is used for transporting the second chip from the second chip stage onto the wafer.

Bonding apparatus and method

A semiconductor structure includes an interconnect structure, at least one first metal pad, at least one second metal pad, at least one first bump, at least one second bump, at least one photosensitive material, and a bonding layer. The first metal pad and the second metal pad are disposed on and electrically connected to the interconnect structure. The first bump is disposed on the first metal pad. The second bump is disposed on the second metal pad. The photosensitive material is disposed on the first bump. The bonding layer is in contact with the photosensitive material and the second bump. The photosensitive material is disposed between the first bump and the bonding layer.

Semiconductor structure and manufacturing method thereof

In accordance with some embodiments, a wafer taping device is provided. The wafer taping device includes a tape delivering along a first direction. The wafer taping device also includes a wafer mount unit disposed below the tape. The wafer mount unit has an upper surface for supporting a wafer and having a notch for allowing a cut mark of the wafer to align with it. The notch is staggered with a second direction in the upper surface, and the second direction is substantially perpendicular to the first direction. In addition, the wafer taping device includes a laminating roller disposed above the wafer mount unit and having a long axis elongated in the second direction. The laminating roller is configured to reciprocate along the first direction for pressing the tape to the wafer.

Device and method for wafer taping

A method for photolithography in semiconductor manufacturing includes providing a mask with first and second focus planes for a wafer. The wafer includes corresponding first and second wafer regions. The first wafer region receives a first image during a first exposure utilizing the first focus plane. The second wafer region receives a second image during a second exposure utilizing the second focus plane.

System and method for photolithography in semiconductor manufacturing

Growing community of inventors

Hsinchu County, Taiwan

Yuh-Sen Chang