Han's Laser Technology Industry Group Co., Ltd.

Yuguo Peng

Xiaojun Zhang

Yunfeng Gao

Xiao Liu

Jiangang Yin

Jiangang Tang

Jiangang Lu

Guodong Ma

Lingtian Diao

Xuerui Yuan

A method for cutting sapphire comprising a sapphire body and a coating formed on the sapphire body, the method comprising: focusing a first COlaser beam the coating via a COfocusing assembly to remove the coating with a predetermined thickness extending along a first path; wherein dust and debris generated during removal of the coating are removed while the coating is removed; focusing an ultrafast laser beam on the sapphire body via an optical path shaping assembly to form a plurality of restructuring channels distributed along a second path and penetrating through the sapphire; wherein the second path coincides with the first path; scanning, by the second COlaser beam, the sapphire body via a galvanometer focusing assembly, wherein a path of the second COlaser beam scanning the sapphire body via a galvanometer focusing assembly coincides with or deviates from the second path, so that the sapphire cracks along the restructuring channels.

Method and device for cutting sapphire

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Shenzhen, China

Yuguo Peng