Mitsui Chemicals, Inc.

Mitsu Chemicals, Inc.

Yugo Yamamoto

Yuichi Ito

Masatoshi Takagi

Yasushi Mizuta

Setsuko Oike

Takashi Nakano

Hiroaki Tamatani

Naritoshi Yoshimura

Mitsuaki Chida

Jun Okabe

Yasushi Takamatsu

Yusuke Tomita

Kimihiko Saito

The image display device sealing material contains a resin component and a curing agent, wherein the resin component contains biphenyl skeleton-containing epoxy resin having a weight-average molecular weight of 200 or more and 100,000 or less, alicyclic skeleton-containing epoxy resin having a weight-average molecular weight of 180 or more and 790 or less, and styrene oligomer having a weight-average molecular weight of 750 or more and 4000 or less.

Image display device sealing material and image display device sealing sheet

The purpose of the present invention is to provide the following: an optical-device surface-sealing composition that makes it possible to fabricate an optical-device-using display with a low amount of warpage even if there is a large difference between the coefficients of linear expansion of substrates used in said display; a display with a low amount of warpage; and a manufacturing method therefor. The storage modulus of elasticity (G'(80)) of this optical-device surface-sealing composition, measured at 80&#xb0; C. after said composition is heated from 40&#xb0; C. to 80&#xb0; C. at 5&#xb0; C./min and then held at 80&#xb0; C. for 30 minutes, is between 1.0&#xd7;10and 2.0&#xd7;10Pa.

Optical-device surface-sealing composition, optical-device surface-sealing sheet, display, and display manufacturing method

To provide a resin composition for sealing an optical semiconductor, which is a raw material for a sealing resin layer having good curability and excellent storage stability; preferably a raw material for a sealing resin layer further having excellent weather resistance. The surface sealant for an optical semiconductor of Embodiment 1 according to the present invention contains epoxy resin (a) having two or more epoxy groups in a molecule, and metal complex (b1) which contains at least one metal ion selected from the group consisting of Zn, Bi, Ca, Al, Cd, La and Zr, a tertiary amine capable of forming a complex with the metal ion and having no N&#x2014;H bond and an anionic ligand having a molecular weight of 17 to 200, in which the surface sealant has a viscosity of 10 to 10000 mPa&#xb7;s, as measured by E-type viscometer at 25&#xb0; C. and 1.0 rpm.

Surface sealant for optical semiconductor, method for manufacturing organic EL device, organic EL device and organic EL display panel using the same

To provide an epoxy polymerizable composition which exhibits low curing shrinkage and high workability and which gives a cured article having a high refraction index and high heat resistance. The epoxy polymerizable composition contains (A2) fluorene epoxy compound having the following general formula (1) or (2), (A3) epoxy compound having a softening point of 30&#xb0; C. or less, and (B1) thiol compound having two or more thiol groups in one molecule. 

Polymerizable epoxy composition, and sealing material composition comprising the same

The invention aims to provide latent curing agents which exert high low-temperature curing properties when used together with ionically polymerizable compounds and which exhibit high storage stability at room temperature. Latent curing agents for ionically polymerizable compounds which agents each contain a hydroxyl-free amine imide compound having an N&#x2014;N bond energy of 100 to 210 kJ/mol as determined by B3LYP functional theory method.

Latent curing agents, epoxy resin compositions containing the same, sealing materials, and organic EL displays

The bonding method of the present invention is a method of bonding a member (a) having a layer (a) comprising an organic polymer (A), and a member (b) containing a compound (B) having specific functional groups, wherein the bonding method comprises bonding the member (a) and the member (b) via a layer comprising an inorganic compound (C) having a nitrogen atom and a hydrogen atom, which is at least partly provided on the outermost surface of the member (a). The composite film of the present invention is, firstly, a composite film formed with a laminate having a layer (a) comprising an organic polymer (A) and a layer (c) comprising an inorganic compound (C) having a nitrogen atom and a hydrogen atom; secondly, a composite film formed with a laminate having the layer (a), the layer (c) and a layer (b) comprising an adhesive resin (B) disposed in this order, wherein the layer (c) and the layer (b) are directly laminated; and thirdly, a composite film formed with a laminate having the layer (a), the layer (c), and a transparent conductive layer (d) disposed in this order, wherein one outermost surface or both outermost surfaces of the composite film are partially formed with the layer (c).

Method for bonding members, composite film and use thereof

A sealing material for a flat panel display contains 100 parts by weight of a compound (A) containing at least one epoxy group in the molecule, and 0.01 to 40 parts by weight of a compound (B) that generates a base upon irradiation. The compound (B) that generates a base upon irradiation is preferably a compound that generates a tertiary amine upon irradiation. The sealing material has favorable curability at low temperature, and a long pot life at room temperature, and does not cause deterioration of display members with ionic components and acids.

Sealing material for flat panel display

It is an object of the present invention to provide a photo-curable resin composition which provides a sealing agent for a flat panel display with good moisture permeation resistance and excellent adhesion. The present inventors have conducted extensive studies to solve the above-described problems, and as a result, they have found a photo-curable resin composition which comprises a cationic photopolymerization initiator (A), a cationically polymerizable compound (B), a cyclic polyether compound (C) and another organic compound (D), wherein the amount of (B) is 1.0 to 99.9% by mass and the amount of (C) is 0.0 to 10.0% by mass, both based on the sum of (B), (C) and (D), and the sum (F) of the fluorine atoms in a fluorine-containing organic compound is 0.0 to 40.0% by mass, based on the sum of (B), (C) and (D), and wherein at least 1/1000 mass ratio of the (B) component is a compound containing an oxetanyl group, and both of the contents of (C) and (F) are not 0.0% by mass at the same time.

Photo-curable resin composition and sealing agent for flat panel display using the same

An ionic compound comprising a cationic portion having a hydroxyl group and/or a carboxylic acid group and an anionic portion of the formula (1):[BR]&#x2003;&#x2003;(1)wherein R may be the same or different and represents a phenyl group substituted with F or CF. Preferably, the anionic portion is [B(CF)], [B(CHCF)]or [B(CHF)]. In other aspects, a radiation polymerization initiator and a resin composition comprising the ionic compound are provided. A resin composition prepared by using the radiation polymerization initiator generates a small amount of outgas during reaction and has excellent reactivity and transparency.

Growing community of inventors

Chiba, Japan

Yugo Yamamoto