Ebara Corporation

Yugang Guo

Junichiro Yoshioka

Kuniaki Horie

Satoshi Morikami

Seiji Katsuoka

Masahiko Sekimoto

Yasuhiko Endo

Masaaki Kimura

Fumio Kuriyama

Nobutoshi Saito

Takashi Takemura

Rei Kiumi

Sachiko Takeda

The present invention is to provide a substrate holder which can effect a more complete sealing with a sealing member and makes it possible to take a substrate out of the substrate holder easily and securely, and also a plating apparatus provided with the substrate holder. The substrate holder includes: a fixed holding member and a movable holding member for holding a substrate therebetween; a sealing member mounted to the fixed holding member or the movable holding member; and a suction pad for attracting a back surface of the substrate held between the fixed holding member and the movable holding member.

Electrochemical deposition method

Electrochemical deposition apparatus

Substrate holder and plating apparatus

A plating apparatus has a steam treatment chamber configured to perform a steam treatment using steam on a surface of a substrate, and a plating chamber configured to plate the surface of the substrate subjected to the steam treatment. The plating apparatus also has an acid treatment chamber configured to bring the surface of the substrate subjected to the steam treatment into contact with an acid liquid. The plating apparatus includes a frame housing the steam treatment chamber, the acid treatment chamber, and the plating chamber.

Plating method and apparatus

A plating method and a plating apparatus, which has a plurality of plating units, for plating a substrate. Each of the plating units includes a plating tank for containing a plating solution therein, a water cleaning tank, disposed adjacent to said plating tank for cleaning the substrate with water, a substrate holder for holding the substrate in a vertical orientation, a vertical displacing mechanism for vertically dipping the substrate holder and a substrate held thereby in the plating solution in the plating tank, and a lateral displacing mechanism or a back-and-forth displacing mechanism for moving the substrate holder while holding the substrate in a vertical orientation between the plating tank and the water cleaning tank. The plating unit also includes a loading/unloading station for loading and unloading the substrate, and a transfer device for transferring the substrate between the plating unit and the loading/unloading station.

Substrate holder, plating apparatus, and plating method

A substrate holder holds a substrate while hermetically sealing an outer circumferential edge and a reverse side of the substrate and exposing a surface of the substrate. The substrate holder has a base and a cover having an opening defined therein and positioned to place the substrate between the base and the cover. An attracting mechanism couples the base and the cover to each other to hold the substrate between the base and the cover, with the surface of the substrate being exposed through the opening.

Growing community of inventors

Tokyo, Japan

Yugang Guo