Chang Chun Petrochemical Co., Ltd.

Yueh-Min Liu

Yao-Sheng Lai

Jui-Chang Chou

Kuei-Sen Cheng

Hsi-Hsing Lo

Tsang-Jin Juo

An electrodeposited copper foil having a texture coefficient of a plane (200) from 50 to 80%, based on the sum of the texture coefficients of a plane (111), the plane (200), a plane (220) and a plane (200) of the electrodeposited copper foil is provided. The electrodeposited copper foil is particularly suitable for use in the applications in printed circuit boards and lithium ion secondary batteries.

Electrodeposited copper foil

The present disclosure relates to a copper foil which exhibits surprising anti-deformation properties (e.g., it is resistant to swelling, sagging, and wrinkling). Typically, the copper foil has (a) a shiny side with a surface roughness (Rz) in the range of 0.6 to 1.9 &#x3bc;m; (b) a matte side with a surface roughness (Rz) in the range of 0.6 to 1.9 &#x3bc;m; and (c) a lightness L* value of the matte side, based on the L*a*b* color system, in the range of 12 to 35. The disclosure further relates to an anode comprising an anode active material on an anode current collector, wherein the anode current collector includes the above-mentioned copper foil. The anodes are used in, for example, lithium ion secondary batteries.

Copper foil exhibiting anti-swelling properties

An electrolytic copper foil includes a copper foil body; and a IIA-group metal adhered to a surface of the copper foil body, wherein a signal strength of the IIA group metal is greater than 0.1% based on a signal strength of copper element as 100% analyzed by a secondary ion mass spectrometer. The present invention also provides a method for cleaning copper foil and a cleaning fluid composition which is used in the cleaning method.

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Taipei, Taiwan

Yueh-Min Liu