Advanced Semiconductor Engineering, Inc.

Yueh-Lung Lin

Tsung-Yueh Tsai

Chian-Chi Lin

Chih-Huang Chang

Po-Nien Chen

Yu-Ting Chien

An optical device includes a carrier including a light transmitting layer and a light shielding layer disposed on the light transmitting layer. The optical device further includes a light emitter disposed on the carrier and a light detector disposed on the carrier. The optical device further includes a light transmitting encapsulant encapsulating the light emitter and the light detector, and a light shielding wall disposed in the light transmitting encapsulant and in contact with the light transmitting encapsulant and the light shielding layer.

Optical device and method of manufacturing the same

A semiconductor chip package manufacturing method and a structure thereof are provided. The manufacturing method includes: providing a base having an image sensor chip and an encapsulant, in which the image sensor chip has pads and an active area; placing a transparent insulator on the active area; forming an insulation layer on an upper surface of the base; opening a plurality of openings to expose the pads; forming a plurality of through holes penetrating the insulation layer and the encapsulant outside of the image sensor chips; forming a metal layer on surfaces of the insulation layer, the openings, the pads and the through holes, and on a lower surface of the base, so as to extend the pads to the lower surface of the base; patterning the metal layer to expose a top area of the transparent insulator and remove a partial area of the metal layer on the lower surface of the base to form contacts; and sawing the base to form a package structure containing a single image sensor chip.

Growing community of inventors

Kaohsiung, Taiwan

Yueh-Lung Lin