Princeton University

Lucent Technologies Inc.

University of Texas System

Yueh-Lin Loo

John A Rogers

Joung Eun Yoo

Zhenan Bao

Howard A Stone

Jason Wolf Fleischer

Peter Kian-Hoon Ho

John A Rodgers

Melda Sezen Edmonds

Nicolas Pegard

Julia Wan-Ping Hsu

Takao Someya

Jongbok Kim

Jong Bok Kim

Pilnam Kim

Jacob Tarver

Kwang Seok Lee

Nicholas C Davy

A photovoltaic cell and method of making are disclosed. The photovoltaic cell includes a substrate having a surface at least partially covered in wrinkles and folds, the folds dividing the surface into a plurality of domains. A photoactive layer is formed on the substrate. At least one transparent electrode is coupled to the photoactive layer and configured to allow transmission of light into the photoactive layer. The domains may have a wrinkle periodicity of less than 2 &#x3bc;m. The folds may have a fold density of less than 0.25. The transport layer may comprise PEDOT:PSS. The photoactive layer may comprise P3HT:PCBM. The photoactive layer may comprise a bulk heterojunction.

Photoelectric cells incorporating wrinkles and folds to enhance efficiency and bendability and method of making

In one aspect, single-junction organic photovoltaic devices are provided exhibiting high Vvalues while employing single-junction architecture. A single-junction photovoltaic device described herein comprises an anode, a cathode and an active layer residing between the anode and cathode, the active layer comprising an organic electron donor and an organic electron acceptor, wherein the photovoltaic device generates a Vof at least 1.4 V. Uniquely, high Vphotovoltaic devices described herein can be transparent to the majority of visible and/or infrared spectral irradiation in some embodiments.

Sing-junction organic photovoltaic devices having high open-circuit voltages and applications thereof

There is disclosed a modular lamination approach for processing organic photosensitive devices that allows the individual processing of device components, that once processed are brought together in a final step to make electrical contact. The disclosed method of preparing a laminated photosensitive device having at least one donor-acceptor heterojunction comprises: preparing a top electrode by depositing a functional material on a flexible substrate, such as an elastomer; optionally processing the functional material to obtain desired properties prior to lamination; preparing a bottom portion by depositing a second functional material over a substrate; optionally processing the second functional material to obtain desired properties prior to lamination; and coupling the top electrode to said bottom portion to form a laminated photosensitive device.

Lamination as a modular approach for building organic photosensitive devices

The present disclosure relates generally to polyaniline (PANI) materials capable of undergoing stable and reversible polyelectrochromic transitions between multiple oxidation states. More specifically, the embodiments described herein include novel PANI-PAAMPSA structures that are capable of undergoing stable and reversible transitions between the ES, LB and PB oxidation states. In some embodiments, the structures described are capable of undergoing stable transitions over a broad pH range. Also described herein are methods of preparing certain electrochromic structures.

Water-dispersible polyaniline films capable of undergoing stable and reversible polyelectrochromic transitions

A method for enhancing electrical conductivity of a film which includes at least one conductive polymer. The method includes providing the film comprising the at least one conductive polymer and at least one polymer acid, agitating the film in at least one reagent; and, placing the film on a heated surface. The at least one reagent includes a reagent acid that is stronger than the polymer acid. The conductivity of the treated film is significantly greater than the conductivity of the untreated film.

Post-processing treatment of conductive polymers to enhance electrical conductivity

The present invention provides a process for forming electrical contacts to a molecular layer in a nanoscale device, the nanoscale device, and a method of manufacturing an integrated circuit comprise such devices. The process includes coating a surface of a stamp with a metal layer and forming an attached layer of anchored molecules by coupling first ends of the anchored molecules to a conductive or semiconductive substrate. The process also includes placing the metal layer in contact with the attached layer of anchored molecules such that the metal layer chemically bonds to free ends of the anchored molecules. The resulting devices produced have superior reliability as compared to conventional prepared devices.

Forming electrical contacts to a molecular layer

The specification describes a contact printing technique for forming patterns of thin films with nanometer resolution over large areas. The procedure, termed here 'nanotransfer printing (nTP)', relies on tailored surface chemistries for transferring thin films, typically metal films, from the raised regions of a stamp to a substrate when these two elements are brought into intimate physical contact. This technique is purely additive, it is fast (&#x3c;15 s contact times), and the printing occurs in a single processing step at room temperature in open air. nTP is capable of producing patterns with a wide range of features with sizes down to &#x2dc;100 nm, and edge resolution better than 25 nm. Electrical contacts and interconnects have been fabricated for high performance organic thin film transistors (TFTs) and complementary inverter circuits, to demonstrate one of the many potential applications for nTP.

Forming nanoscale patterned thin film metal layers

The specification describes a lamination method for thin film transistor TFT devices wherein each ply of the laminate is a polymer and each contains a portion of the TFT or the interconnection circuit. The plies are laminated together using a solid adhesive polymer layer on the surface of one or both of the plies. The solid adhesive polymer layer has a low elastic modulus that provides effective encapsulation of the TFT, and laminates the plies without high heat or pressure.

Growing community of inventors

Princeton, NJ, United States of America

Yueh-Lin Loo