Industrial Technology Research Institute

Yueh-Chuan Huang

Chyi-Ming Leu

Meng-Ting Hsieh

Mei-Rurng Tseng

Kai-Chi Chen

Tien-Shou Shieh

Chih-Hao Lin

Wen-Bin Chen

Chi-Fu Tseng

Jung-Yu Liao

Yung Lung Tseng

A curable composition and an electronic device employing the same are provided. The curable composition includes 100 parts by mole of a first siloxane compound represented by Formula (I) wherein n is 8 to 232, wherein Ris independently Calkyl group; 1 to 15 parts by mole of a second siloxane compound represented by Formula (II) wherein x&#x2265;2, y&#x2265;2, and x/y is between 0.1 and 3, and R, Rand Rare independently Calkyl group; 1 to 15 parts by mole of a third siloxane compound represented by Formula (III) and 90 to 250 parts by mole of a curing agent represented by Formula (IV) wherein m is 7 to 230, wherein Ris independently Calkyl group.

Curable composition and electronic device employing the same

The present disclosure provides a substrate structure for an electronic element, which includes a supporting carrier; a release layer having a first microstructure on a surface thereof, and the release layer having first adhesion to the supporting carrier; and a flexible substrate for disposing the supporting carrier and the release layer thereon, wherein the flexible substrate has second adhesion to the release layer, the first adhesion is greater than the second adhesion, and the surface of the flexible substrate in contact with the surface of the release layer has a second microstructure opposing to the first microstructure. The present disclosure further provides a method for fabricating the substrate structure.

Substrate structure for electronic device and production method thereof

A substrate structure applied in flexible electrical devices is provided. The substrate structure includes a carrier, a first material layer overlying the carrier with a first area, a second material layer overlying the first material layer and the carrier with a second area, and a flexible substrate overlying the second material layer, the first material layer and the carrier with a third area, wherein the second area is larger than or equal to the first area, the third area is larger than the second area, and the flexible substrate has a greater adhesion force than that of the first material layer to the carrier. The invention also provides a method for fabricating the substrate structure.

Substrate structures applied in flexible electrical devices and fabrication method thereof

An optical device structure with a light outcoupling layer is provided. The optical device structure includes a substrate having a first surface and a second surface, and a layer of polyimide (PI) or its copolymer formed on the first surface of the substrate, wherein the layer of polyimide or its copolymer is prepared from at least one aromatic diamine and at least one cycloaliphatic dianhydride, and an optical component formed on the layer of polyimide or its copolymer.

Optical device structures with the light outcoupling layers

Disclosed is an organic light emitting diode (OLED), including a flexible substrate having a surface with a bulge and groove structure. The OLED also includes a first electrode on the flexible substrate, an organic light emitting layer on the first electrode, and a second electrode on the organic light emitting layer. The flexible substrate includes polyimide.

Organic light emitting diode having polymide-containing flexible substrate and having surface with bulge and groove structure

A substrate structure applied in flexible electrical devices is provided. The substrate structure includes a carrier, a flexible substrate opposed to the carrier, a release layer formed on a surface of the flexible substrate opposed to the carrier, and an adhesive layer formed between the carrier, the release layer and the flexible substrate, wherein the area of the adhesive layer is larger than that of the release layer, and the adhesive layer has a greater adhesion force than that of the release layer to the flexible substrate. The invention also provides a method for fabricating the substrate structure.

A substrate structure applied in flexible electrical devices is provided. The substrate structure includes a carrier, a release layer overlying the carrier with a first area and a flexible substrate overlying the release layer and the carrier with a second area, wherein the second area is larger than the first area and the flexible substrate has a greater adhesion force than that of the release layer to the carrier. The invention also provides a method for fabricating the substrate structure.

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Jhudong, Taiwan

Yueh-Chuan Huang