Applied Materials, Inc.

Yue Cui

Jiao Song

Nuno Yen-Chu Chen

Mengxue Wu

Kirankumar Neelasandra Savandaiah

Arvind Sundarrajan

Guan Huei See

Yueh Sheng Ow

Siew Kit Hoi

David Gunther

Madan Kumar Shimoga Mylarappa

Felix Deng

Jay Min Soh

Palaniappan Chidambaram

Chul Nyoung Lee

Methods of curing a polymer layer on a substrate using variable microwave frequency are provided herein. In some embodiments, methods of curing a polymer layer on a substrate using variable microwave frequency include (a) forming a first thin-film polymer layer on a substrate, the first thin-film polymer layer including at least one first base dielectric material and at least one microwave tunable material, (b) applying a variable frequency microwave energy to the substrate and the first thin-film polymer layer to heat the substrate and the first thin-film polymer layer to a first temperature, and (c) adjusting the variable frequency microwave energy applied to the substrate and the first thin-film polymer layer to tune at least one material property of the first thin-film polymer layer.

Methods for forming microwave tunable composited thin-film dielectric layer

Target profile for a physical vapor deposition chamber target

Methods and apparatus for processing a substrate are provided herein. For example, a method for processing a substrate comprises applying a DC target voltage to a target disposed within a processing volume of a plasma processing chamber, rotating a magnet disposed above the target at a default speed to direct sputter material from the target toward a substrate support disposed within the processing volume, measuring in-situ DC voltage in the processing volume, the in-situ DC voltage different from the DC target voltage, determining if a measured in-situ DC voltage is greater than a preset value, if the measured in-situ DC voltage is less than or equal to the preset value, maintaining the magnet at the default speed, and if the measured in-situ DC voltage is greater than the preset value, rotating the magnet at a speed less than the default speed to decrease the in-situ DC voltage.

Methods and apparatus for processing a substrate

Growing community of inventors

Singapore, Singapore

Yue Cui