Foxconn Technology Co., Ltd.

Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.

Yue-Bin Wang

Fei Chen

Di-Qiong Zhao

Yi-Chyng Fang

A memory module assembly () includes a memory card () having a right side surface () and a left side surface (), a heat sink () and a heat pipe (). The heat sink includes a base member () attached to the left side surface of the memory card and a shell () attached to the right side surface of the memory card and coupled to the base member. The base member includes a substrate portion () attached to the left side surface of the memory card and a support portion () extended from the substrate portion and supported on a top edge of the memory card. The heat pipe includes an evaporator () in thermal engagement with one of the shell and the substrate portion and a condenser () in thermal engagement with the support portion.

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Shenzhen, China

Yue-Bin Wang