Applied Materials, Inc.

Nanometrics Inc.

Yudong Hao

Shifang Li

Zhuan Liu

Jiangtao Hu

Ye Feng

Xinyuan Chong

Andreas Schulze

Yongdong Liu

Chengqing Wang

Chao Liu

Methods and systems for temperature-based metrology calibration at a manufacturing system are provided. First metrology data corresponding to one or more first temperatures associated with a substrate following a completion of one or more portions of a substrate process at a manufacturing system is obtained. Second metrology data corresponding to a second temperature associated with the substrate following the completion of the substrate process is determined in view of calibration data associated with the substrate. The second temperature is different from each of the one or more first temperatures. In response to a determination, in view of the second metrology data, that a modification criterion associated with the substrate process is satisfied, the substrate process recipe is modified.

Temperature-based metrology calibration at a manufacturing system

A method includes receiving, by a processing device, first data. The first data includes data from one or more sensors of a processing chamber and is associated with a processing operation. The first data is resolved in at least two dimensions, one of which is time. The method further includes providing the first data to a model. The method further includes receiving from the model second data. The second data includes an indication of an evolution of a processing parameter during the processing operation. The method further includes causing performance of a corrective action in view of the second data.

Holistic analysis of multidimensional sensor data for substrate processing equipment

A model of a sample with a periodic or non-periodic pattern of conductive and transparent materials is produced based on the effect that the pattern has on TE polarized incident light. The model of the pattern may include a uniform film of the transparent material and an underlying uniform film of the conductive material. When the pattern has periodicity in two directions, the model may include a uniform film of the transparent material and an underlying portion that based on the physical characteristics of the periodic pattern in the TM polarization direction. When the sample includes an underlying periodic pattern that is orthogonal to the top periodic pattern, the sample may be modeled by modeling the physical characteristics of the top periodic pattern and the effect of the bottom periodic pattern. The model may be stored and used to determine a characteristic of the sample.

Modeling conductive patterns using an effective model

A metrology system performs optical metrology while holding a sample with an unknown focus offset. The measurements are corrected by fitting for the focus offset in a model regression analysis. Focus calibration is used to determine the optical response of the metrology device to the focus offset. The modeled data is adjusted based on the optical response to the focus offset and the model regression analysis fits for the focus offset as a variable parameter along with the sample characteristics that are to be measured. Once an adequate fit is determined, the values of the sample characteristics to be measured are reported. The adjusted modeled data may be stored in a library, or alternatively, modeled data may be adjusted in real-time.

Correction of optical metrology for focus offset

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Fremont, CA, United States of America

Yudong Hao