Boe Technology Group Co., Ltd.

Chengdu Boe Optoelectronics Technology Co., Ltd.

Yudan Shui

Yanping Ren

Lian Xiang

Zhengmao Yu

Wenkang Wang

Shanghong Li

Chenyu Chen

Wenbo Chen

Ping Luo

Zhongliu Yang

Yongfu Diao

Xuan Luo

Guowei Chen

An apparatus for fixing a display includes a fixing frame and a positioning device. The fixing frame is defined by a plurality of surrounding side plates, a space for accommodating the display is surrounded by the side plates, and a cavity is formed within the side plate. The positioning device is provided within the cavity and includes a positioning assembly and a driving assembly. The positioning assembly includes an inserting-connecting member and a transmission mechanism, the inserting-connecting member is slidably extended into the space surrounded by the side plates, and the inserting-connecting member is connected to the transmission mechanism. The driving assembly is connected to the transmission mechanism and configured to drive, via the transmission mechanism, the inserting-connecting member to slide, so that the inserting-connecting member is inserted into or separated from an inserting hole in the display.

Display device and display fixing apparatus

The present disclosure provides a chip-on-film structure, a display apparatus and a methods for manufacturing the display apparatus. The display apparatus includes: a base substrate; a bonding structure disposed on the base substrate; and a chip-on-film COF structure, wherein the COF structure and a side of the bonding structure that is away from the base substrate are clamped with each other, and the COF structure is bonded to the side of the bonding structure that is away from the base substrate; wherein when the COF structure and the bonding structure are bonded, the COF structure contacts both a first surface and a second surface of the bonding structure at the side of the bonding structure that is away from the base substrate, wherein the first surface is parallel to the base substrate, and the second surface is at an angle with the first surface.

Chip-on-film structure, display apparatus and method for manufacturing same

Disclosed in the present disclosure are a transparent display panel and a display device, used for prolonging the service life of an electroluminescent device in the transparent display panel. According to the transparent display panel provided by the embodiment of the present disclosure, the transparent display panel is divided into a display area arranged in an array and a light-transmitting area surrounding the display area; the display area comprises a transparent substrate, an electroluminescent device positioned on the transparent substrate, and a light blocking part located on the side of the transparent substrate deviating from the electroluminescent device; the light blocking part is used for blocking light entering from the side of the transparent substrate deviating from the electroluminescent device to irradiate the electroluminescent device.

Transparent display panel and display device

A pixel structure, a driving method thereof and a display device are disclosed. The pixel structure includes: a pixel circuit and a plurality of light emitting devices; the pixel circuit has a plurality of display periods, each display period includes: a first reset stage, a data write stage, a second reset stage and a light emitting stage, the driving method includes: in the second reset stage, providing a valid level signal to at least one second reset line to cause the corresponding second reset sub-circuit to write a voltage on the initialization signal line into a first electrode of the light emitting device; in the light emitting stage, providing a valid level signal to a first light emitting control line and providing a valid level signal to at least one second light emitting control line.

Pixel structure, driving method thereof and display device

The disclosure discloses a display panel, a preparation method thereof and a display device. The display panel includes: a base substrate, a plurality of light emitting devices located on the base substrate, and a film packaging structure located on a side, away from the base substrate, of the light emitting devices, wherein the film packaging structure includes a first inorganic packaging film on the side, away from the base substrate, of the light emitting devices, a second inorganic packaging film on the side, away from the light emitting devices, of the first inorganic packaging film, and an organic packaging film between the first inorganic packaging film and the second inorganic packaging film; and the first inorganic packaging film is provided with convex structures at gaps among the light emitting devices, and the organic packaging film is disconnected at the convex structures.

Display panel, preparation method thereof and display device

In one embodiment, a foldable display module includes a foldable OLED display panel; a heat conduction unit and a heat dissipation unit sequentially disposed on the OLED display panel in a direction away from a light exit side of the OLED display panel; and a plurality of semiconductor sinks located between the heat conduction unit and the heat dissipation unit, wherein the heat conduction unit is adhered to a side of the OLED display panel away from the light exit side and is configured to conduct heat from the OLED display panel; the semiconductor sinks are disposed on the heat conduction unit; the heat dissipation unit covers the semiconductor sinks and the heat conduction unit; and the semiconductor sinks are configured to absorb heat from the heat conduction unit and dissipate the heat through the heat dissipation unit, in response to a direct-current voltage applied to the semiconductor sinks.

Foldable display module, method of manufacturing foldable display module, display apparatus and heat dissipation method

A display substrate and a manufacturing method therefor, and a display device are provided. The display substrate includes a base substrate, a plurality of sub-pixels, a plurality of data lines, a plurality of data lead lines, at least one group of contact pads, and a first insulation layer. The base substrate includes a display region and a bonding region; the data lines are configured to provide data signals to the sub-pixels; the data lead lines are electrically connected to the data lines, respectively; the at least one group of contact pads includes a first group of contact pads and a second group of contact pads; the first insulation layer is in gaps between the contact pads and covers edges of the contact pads, and is configured to expose surfaces, away from the base substrate, of the contact pads.

Growing community of inventors

Beijing, China

Yudan Shui