Disco Corporation

Yuannan Li

Kazuma Sekiya

Tomotaka Tabuchi

A grinding apparatus includes a first chuck table that has a porous holding surface corresponding to a first wafer and holds the first wafer, a second chuck table that has a porous holding surface corresponding to a second wafer different from the first wafer in size or shape and holds the second wafer, and a grinding unit that grinds, by a grinding wheel, the first wafer sucked and held by the first chuck table positioned at the grinding position or the second wafer sucked and held by the second chuck table positioned at the grinding position.

Growing community of inventors

Tokyo, Japan

Yuannan Li