University of Electronic Science and Technology of China

Other

Zhuhai Yuexin Semiconductor Limited Liability Company

Yuanming Chen

Wei He

Yan Wang

Lei Feng

Benxia Huang

Min Lin

Xianming Chen

Yi Shen

Dainan Zhang

Jiujuan Li

Jiatong Gao

Shouxu Wang

Guoyun Zhou

Dezhi Lin

Chong Wang

Xichun Wu

Yongbin Huang

Yinghuang Sun

Dingji Chen

Yongzhi Zeng

Yanlin Dong

Keng Lin

Yuemin Lv

Yan Hong

In a fabrication method for a package structure, a copper foil is provided, electroplating is performed on the copper foil to form a cavity sacrificial post, a dielectric material is laminated to form a dielectric layer, wherein an end face of the cavity sacrificial post is exposed to the dielectric layer, a wiring layer is formed on the dielectric layer, the cavity sacrificial post is removed by etching to form a through cavity, a bonding pad is formed on the wiring layer, a reverse side of a device is mounted on the copper foil in the through cavity, and a terminal of the device is wire-bonded with the bonding pad.

Fabrication method for package structure

A composite conductive polymer, a preparation method thereof and application thereof are disclosed, wherein a mixed solution A is used in the preparation process of the composite conductive polymer, which comprises the following two components: (i) a strong oxidant selected from at least one of permanganate, persulfate, dichromate and perchlorate; (ii) an oxidizing agent containing a metal ion capable of being reduced to elementary substance. The preparation process is simple and easy to operate, with low cost and favorable environmental protection and the obtained composite conductive polymer containing metal in elementary form, has good film-forming property and the film thereof can completely cover the surface of the insulating substrate, with excellent electrical conductivity, which therefore can be widely used in electroplating materials and semiconductor materials and other fields.

Composite conductive polymers, preparation method and application thereof

A capacitive touch screen, having a first transparent substrate provided with a touch circuit layer. The touch circuit layer is provided with first and second electrodes and a jumper portion. The touch screen is further provided with an insulating layer. The insulating layer is continuously disposed in an entire transparent touch area of the touch screen, and is provided with through holes at the jumper portion to form a jumper connection of the second electrode. The touch screen further includes a shielding layer sandwiched between the first transparent substrate and the touch circuit layer, and contains multiple shielding blocks. The shielding blocks correspond to the through holes, and the contours of the shielding blocks are formed by expanding the contours of the through holes outwards. The capacitive touch screen can effectively reduce side light reflection on an edge slope of the insulating layer, thereby avoiding interference with display.

Capacitive touch screen capable of reducing side light reflection

Growing community of inventors

Guangdong, China

Yuanming Chen