Sandisk Semiconductor (shanghai) Co. Ltd.

Sandisk Information Technology (shanghai) Co., Ltd.

Yuang Zhang

Chin-Tien Chiu

Li Ping Wang

Ning Ye

Shrikar Bhagath

Cheeman Yu

Suresh Kumar Upadhyayula

Zhong Lu

Weili Wang

Kim Lee Bock

Kaiyou Qian

King Hoo Ong

Peng Fu

Enyong Tai

Lu Zhong

Pradeep Kumar Rai

A semiconductor package including a plurality of stacked semiconductor die, and methods of forming the semiconductor package, are disclosed. In order to ease wirebonding requirements on the controller die, the controller die may be mounted directly to the substrate in a flip chip arrangement requiring no wire bonds or footprint outside of the controller die. Thereafter, a spacer layer may be affixed to the substrate around the controller die to provide a level surface on which to mount one or more flash memory die. The spacer layer may be provided in a variety of different configurations.

Semiconductor device including independent film layer for embedding and/or spacing semiconductor die

A semiconductor wafer, die and semiconductor package formed therefrom are disclosed, where the inactive surface of the wafer has an extrinsic gettering pattern formed from a texturing process. In examples, the texturing process follows a polishing process that removes stress concentration point from the inactive surface of the wafer.

Extrinsic gettering on semiconductor devices

Growing community of inventors

Shanghai, China

Yuang Zhang