Samsung Electronics Co., Ltd.

Yuan Xu

Yi Zhang

Ephraim Suhir

Carlos Dangelo

Subrata Dey

Peter V Schwartz

Barbara Wacker

Bala Padmakumar

Arthur Boren

Darin Olsen

One aspect of the invention includes a copper substrate; a catalyst on top of the copper substrate surface; and a thermal interface material that comprises a layer containing carbon nanotubes that contacts the catalyst. The carbon nanotubes are oriented substantially perpendicular to the surface of the copper substrate. A Raman spectrum of the layer containing carbon nanotubes has a D peak at &#x2dc;1350 cmwith an intensity ID, a G peak at &#x2dc;1585 cmwith an intensity IG, and an intensity ratio I/Iof less than 0.7 at a laser excitation wavelength of 514 nm. The thermal interface material has: a bulk thermal resistance, a contact resistance at an interface between the thermal interface material and the copper substrate, and a contact resistance at an interface between the thermal interface material and a solid-state device. A summation of these resistances has a value of 0.06 cmK/W or less.

Carbon nanotube-based structures and methods for removing heat from solid-state devices

A method and apparatus for the evaluation and improvement of the mechanical and thermal properties of carbon-nanotube (CNT) and carbon nanofiber (CNF) arrays grown on a substrate is disclosed. The Young's modulus of a CNT/CNF material is measured by applying an axial compressive force on the CNT/CNF array and measuring the applied forces and the induced displacements. Also disclosed are the evaluation of the nonlinear stress-strain relationship of the CNT/CNF material, increasing of the Young's modulus and decreasing the thermal resistance by application of a compressive load, the application of rapid thermal annealing to improve the quality of the CNT/CNF material and to reduce the interfacial thermal resistance, improvement of the bonding strength of the CNT/CNF array to a substrate, evaluation of the bonding strength of the CNT/CNF array to a substrate, evaluation of the shearing force at failure, and an analytical stress model that enables one to predict the interfacial shearing stress from the measured force.

Method and apparatus for evaluation and improvement of mechanical and thermal properties of CNT/CNF arrays

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Milpitas, CA, United States of America

Yuan Xu