Industrial Technology Research Institute

Yuan-Tsu Wan

Chun-Hsien Liu

Weng-Jung Lu

Chih-Min Lin

Chao-Hsien Huang

Chun-Kuei Lai

Chin-Yuan Liu

The invention is a device for fast taking out and putting in, especially the device can fast take out a chip from a wafer to put in another chip receptacle, wherein, the invention includes a gear set, which consists of a first big gear, a second big gear and a small gear; at least two driving device, which consists a first driving device and a second driving device; a link mechanism, which cooperates with the gear set to proceed that the link mechanism moves forth toward a non-horizontal direction and back toward the reverse direction, and moves down toward a non-vertical direction and up toward the reverse direction as well; a lift mechanism, which is driven by the first driving device, and a mold plate with gear set and link mechanism is then driven either to complete the actions of moving down toward a non-vertical direction and up toward the reverse direction as mentioned above. The second driving device drives gear set, which utilizes the rotation of gear set to complete the actions of moving forth toward a non-horizontal direction and back toward the reverse direction as mentioned above.

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Hsin Tien, Taiwan

Yuan-Tsu Wan