Tcl China Star Optoelectronics Technology Co., Ltd.

Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.

Yuan Mei

Jincheng Li

Haoxu Wu

A etching method of a copper-molybdenum film and an array substrate are provided. The etching method of a copper-molybdenum film includes forming a copper-molybdenum film on a substrate; forming a photoresist in a predetermined pattern on the copper-molybdenum film; etching a copper film of the copper-molybdenum film with an acidic first etching solution; etching a molybdenum film of the copper-molybdenum film with a neutral or basic second etching solution, to form the copper-molybdenum film in the predetermined pattern.

Etching method of copper-molybdenum film and array substrate

The present disclosure provides an array substrate and a display panel. The driving circuit layer of the array substrate provided with a first thin-film transistor (TFT) and a second TFT. An exemplified active layer of a P-type TFT is formed by organic conductive polymer material. By using organic conductive polymer materials as the active layer material of the first TFT, the technical problems of the flexibility of the display substrate resulting by the characteristics of the low temperature polysilicon material are solved. The flexibility of the array substrate is enhanced.

Array substrate and display device

The present disclosure provides an anisotropic conductive film, a display panel, and manufacturing method thereof. The anisotropic conductive film includes a conductive particle, the conductive particle including a covalent organic framework material, the covalent organic framework material including PyVg-COF. The display panel including a first substrate, a second substrate and an anisotropic conductive film. The method of manufacturing the display panel including: providing a first substrate, coating an anisotropic conductive film on the first substrate, coupling the second substrate to the first substrate, and bonding the first substrate to the second substrate. The present disclosure provides the conductive particles of the covalent organic frame material replace the existing gold ball as an anisotropic conductive film for bonding, thereby saving the manufacturing cost of the gold ball, improving the conductivity and water resistance, and avoiding the bonding contact point being oxidation.

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Guangdong, China

Yuan Mei