Google Inc.

Yuan Li

Madhusudan K Iyengar

Padam Jain

Connor Burgess

Emad Samadiani

Norman Paul Jouppi

Christopher Gregory Malone

Yang Song

Hartwig Adam

Feini Zhang

Rama Ranganath

Teckgyu Kang

Bo Wu

Woon-Seong Kwon

Jorge Padilla

Melanie Beauchemin

William F Edwards

Arjita Madan

Guibin Kong

Yingying Wang

Kishore Kumar

Fabian Daniel Schlup

Erick Tuttle

Nicholas Stevens-Yu

Zhi Yang

Yichi Zhang

Jun Lan

Cong Liu

Vivek Agarwal

Jiang Sheng

Weijia He

Michael Yeung

Joshua Tan

Steven Soneff

Lee Lee Choo

Xiao Zhang

Madhusudan Krishnan Iyengar

Eric Tuttle

Systems and methods for using spring force based compliance to minimize the bypass liquid flow gaps between the tops of chip microfins and bottom side of manifold ports are disclosed herein. A fluid delivery and exhaust manifold structure provides direct liquid cooling of a module. The manifold sits on top of a chip with flow channels. Inlet and outlet channels of the manifold in contact with flow channels of the chip creates an intricate crossflow path for the coolant resulting in improved heat transfer between the chip and the working fluid. The module is also designed with pressure reduction features using internal leakage flow openings to account for pressure differential between fluid entering and being expelled from the module.

Spring loaded compliant coolant distribution manifold for direct liquid cooled modules

According to an aspect of the disclosure, an example microelectronic device assembly includes a substrate, a microelectronic element electrically connected to the substrate, a stiffener element overlying the substrate, and a heat distribution device overlying the rear surface of the microelectronic element. The stiffener element may extend around the microelectronic element. The stiffener element may include a first material that has a first coefficient of thermal expansion ('CTE'). A surface of the stiffener element may face toward the heat distribution device. The heat distribution device may include a second material that has a second CTE. The first material may be different than the second material. The first CTE of the first material of the stiffener element may be greater than the second CTE of the second material of the heat distribution device.

Methods and heat distribution devices for thermal management of chip assemblies

Systems and methods for utilizing the dead space around the periphery of a chip for sealing a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. A groove member for receiving a sealing member may be applied to the top surface of the chip. The groove member may be directly deposited to the top surface or coupled thereto via an adhesive and/or epoxy. The groove member may be in the form of opposing sidewalls or a u-shaped structure each of which form a partial enclosure for receipt of the sealing member. The groove member may be located entirely within the dead space or at least partially within the dead space and partially within a central area in which the chip components are located. The sealing member may be an O-ring or a gasket.

Direct liquid cooling with O-ring sealing

A method of manufacturing a chip assembly comprises joining an in-process unit to a printed circuit board; reflowing a bonding material disposed between and electrically connecting the in-process unit with the printed circuit board, the bonding material having a first reflow temperature; and then joining a heat distribution device to the plurality of semiconductor chips using a thermal interface material ('TIM') having a second reflow temperature that is lower than the first reflow temperature. The in-process unit further comprises a substrate having an active surface, a passive surface, and contacts exposed at the active surface; an interposer electrically connected to the substrate; a plurality of semiconductor chips overlying the substrate and electrically connected to the substrate through the interposer, and a stiffener overlying the substrate and having an aperture extending therethrough, the plurality of semiconductor chips being positioned within the aperture.

A computing system () that includes at least one microapp () and a container application () configured to receive an application output from the microapp(s) () via an application programming interface. The computing system () can include at least one processor () and at least one tangible, non-transitory computer-readable medium that stores instructions that, when executed by the at least one processor (), cause the at least one processor () to perform operations. The operations can include providing, for display within a first panel () in a user interface (), a navigation bar () based on data received from the container application (); receiving, at the container application (), the application output from the at least one microapp () via the application programming interface; and providing, for display within a second panel in the user interface (), data describing the application output.

Application and platform for integrating microapps using application programming interfaces (APIs)

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Sunnyvale, CA, United States of America

Yuan Li