Nexperia B.v.

Yuan Li

Qingyuan Tang

JinXin Yi

Jennifer Schuett

YuJun Zhao

Frank Burmeister

Dicky Tirta Djaja

A substrate-based package semiconductor device is provided. The present disclosure further relates to a carrier including a plurality of non-singulated substrate-based package semiconductor devices and to a method of manufacturing the same. In embodiments in accordance with the present disclosure, the lowest insulating layer(s) has/have cavities arranged near and associated with one or more package terminals, and an inner wall of the cavities is covered with a conductive body that connects to the respective associated package terminal. Furthermore, the non-singulated substrate-based package semiconductor devices are separated by a separating region of the substrate, and the cavities are at least partially formed in the separating region.

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Nijmegen, Netherlands

Yuan Li