Powertech Technology Inc.

Yuan-Jung Lu

Cheng Chun Chang

Shin-Kung Chen

Chu Yuan Mo

Yen-Yu Chen

Ching-Chia Yang

Pao-Chen Lin

Ming Hsiu Hsieh

Fu-Hsiang Chang

Hsing-Fu Peng

A head of a tag device having a body, at least one row of negative-pressure through holes and at least one row of positive-pressure through holes. The body has a first surface and a second surface. The rows of negative and positive-pressure through holes are formed through the first and second surfaces of the body and arranged along a long-axis direction. Two negative and positive-pressure through holes at both ends of the corresponding row of negative and positive-pressure through holes are respectively close to the short sides of the body. Therefore, an effective labeling area is distributed between two short sides. The head of the tag device of the present invention provides a stable labeling operation for different products where different components are mounted and increases units per hour (UPH).

Head of a tag device

A wafer transferring device adapted to suck and transfer a first wafer is provided. The wafer transferring device includes an arm and a supporting carrier. The supporting carrier is connected to the arm. The supporting carrier has a single vacuum suction port exposed to an upper surface of the supporting carrier. The supporting carrier is adapted to move to a position below the first wafer. The single vacuum suction port is adapted to suck a first central region of the first wafer so as to lift up and transfer the first wafer.

Wafer transferring device

Growing community of inventors

Hsinchu County, Taiwan

Yuan-Jung Lu