Au Optronics Corporation

Yuan-Hung Tung

Yi-Wei Lee

Chih-Jui Pan

Chin-Kuo Ting

An active device array substrate comprising a substrate, a pixel array, a partition configuration and an alignment material layer is provided. The substrate has an alignment region and a predetermined sealing region. The predetermined sealing region surrounds the alignment region. The pixel array is disposed on the substrate within the alignment region. The partition configuration is disposed on the substrate between the predetermined sealing region and the alignment region. The alignment material layer is disposed within the alignment region and covers the pixel array.

Active device array substrate, color filter substrate and manufacturing methods thereof

A method for manufacturing an alignment layer is provided, which includes the following steps. First, a substrate is provided. Next, an auxiliary layer is formed on the substrate. Then, an alignment solution is sprayed on the auxiliary layer through an inkjet printing process. The alignment solution includes an alignment material and a first solvent, and the auxiliary layer has the same polarity as the first solvent. Then, by performing a curing process, the alignment solution is cured to form an alignment layer. As mentioned above, the method for manufacturing an alignment layer may be applied to manufacture an alignment layer with preferred smoothness.

Methods for manufacturing alignment layer, active device array substrate and color filter substrate

A method of fabricating an active device array substrate is provided. First, a substrate is provided. A pixel array is formed on the substrate. An alignment material layer having a plurality of alignment regions is formed on the pixel array. A mask layer is formed on a portion of the alignment regions on the alignment material layer by using an inkjet printing process, so as to expose another portion of the alignment regions on the alignment material layer. Then, a particle beam alignment process is performed to the exposed alignment material layer. Then, the mask layer is removed. Another mask layer is formed on the alignment material layer which has been treated by the particle beam to expose the alignment material layer not treated by the particle beam. Another particle beam alignment process is performed to the exposed alignment material layer, and then the another mask layer is removed.

Growing community of inventors

Taoyuan, Taiwan

Yuan-Hung Tung