Industrial Technology Research Institute

Yuan-Heng Sun

Chien-Hong Lin

Chih-Yuan Liu

Ruey-Liang Ma

Jen-Yu Yu

Jing-Shan Liang

Kang-Feng Lee

Yeu-Horng Shiau

Yuan-Ann Chang

Meng-Ru Lin

A multi-diameter clamp for clamping on tires of different sizes is provided. The multi-diameter clamp comprises at least one clamping unit, at least one actuator, and at least one sensing unit. The at least one clamping unit further includes at least one movable member and a fixed member. Wherein the at least one movable member moves within a tire housing space having a starting position and a clamping position. The tire housing space locates between the movable member and the fixed member for clamping on a tire. The at least one actuator connects to the at least one movable member, and enables the at least one moveable member to move between the starting position and the clamping position. The at least a sensing unit obtains a diameter size of the tire, and based on the diameter size, actuates the at least one actuator corresponding to the diameter size.

Multi-diameter clamp for clamping on tires of different sizes

A USB SSIC thin card device and a data transfer method thereof are provided. A first universal serial bus (USB) physical layer circuit is controlled by a USB device control unit to transmit data through a pair of first differential signal pins and a pair of a second differential signal pins, wherein the first USB physical layer circuit is used to transmit data complied with a USB 3.0 SSIC transmission specification.

USB SSIC thin card device and data transfer method thereof

A card structure includes a first element and a second element. The first element includes a first peripheral portion and a plurality of first contact points exposed by the first peripheral portion. The second element includes a second peripheral portion and a plurality of second contact points corresponding to the first contact points of the first element and exposed by the second peripheral portion. When the first and second elements are joined with each other, the first peripheral portion of the first element and the second peripheral portion of the second element are adjacent to each other, to juxtapose the first contact points of the first element and the second contact points of the second element to each other. The juxtaposed first and second contact points of the first and second elements are coupled to each other by a welding portion.

Card structure, socket structure, and assembly structure thereof

Exemplary embodiments of optical USB thin card is disclosed, which includes a substrate, having a space formed inside its packaging layer; a seat, disposed at a position on the substrate while forming an opening on the substrate; a plurality of first contact elements, each being disposed on the seat to be used for connecting electrically with an external device; a plurality of second contact elements, each being disposed on the seat to be used for connecting electrically with an external device; and bidirectional optical transmission module, having a plurality of optical fiber, disposed inside an accommodation space formed by the enclosure of the seat and the substrate; a micro control unit, for processing signals, data and commands of the optical USB thin card.

Optical USB thin card

A card structure includes a first substrate, a second substrate, and a connector. The first substrate includes a base surface, wherein at least one electronic part region and a terminal region are disposed on the base surface. The second substrate is disposed on the base surface and is coupled to the terminal region of the first substrate. The connector is disposed on the base surface to juxtapose the second substrate. The connector includes a connecting surface, a contact unit, and a plurality of contact regions disposed on the connecting surface and coupled to the contact unit and the terminal region, such that the plurality of contact regions are coupled to the second substrate via the terminal region of the first substrate.

A cascade-able serial bus device for coupling between a host device and another serial bus device is disclosed. The host device includes a serial bus interface. The serial bus device includes a first connection interface, a second connection interface and a bypassing module. The first connection interface is coupled to the serial bus interface of the host device. The second connection interface is coupled to the second serial bus device. The bypassing module is coupled to a chip select (CS) signal line of the serial bus interface and the second connection interface for selectively bypassing or non-bypassing the CS signal to the second serial bus device.

Growing community of inventors

Taipei, Taiwan

Yuan-Heng Sun