Taiwan Semiconductor Manufacturing Comp. Ltd.

Globalwafers Co., Ltd.

Yuan-Hao Chang

Po-Sheng Lu

Zhiqiang Wu

Nuo Xu

Ping-Wei Wang

Shih-Hao Lin

Wen-Ching Hsu

Hsin-Wen Su

Jui-Lin Chen

Chenchen Jacob Wang

Ying-Ru Shih

Te-Hao Lee

A semiconductor package, a semiconductor device and a shielding housing for a semiconductor package are provided. The semiconductor package includes a semiconductor chip having a first region and a second region beside the first region; and a shielding housing encasing the semiconductor chip, made of a magnetic permeable material, and including a first shielding plate, a second shielding plate opposite to the first shielding plate and a shielding wall extending between the first shielding plate and the second shielding plate. The first shielding plate has an opening exposing the first region and includes a raised portion surrounding the opening and a flat portion beside the raised portion and shielding the second region. A first distance from a level of the semiconductor chip to an outer surface of the raised portion is greater than a second distance from the level to an outer surface of the flat portion.

Semiconductor package, semiconductor device and shielding housing of semiconductor package

A magnetic device structure is provided. In some embodiments, the structure includes one or more first transistors, a magnetic device disposed over the one or more first transistors, a plurality of magnetic columns surrounding sides of the one or more first transistors and the magnetic device, a first magnetic layer disposed over the magnetic device and in contact with the plurality of magnetic columns, and a second magnetic layer disposed below the one or more first transistors and in contact with the plurality of magnetic columns.

Magnetic device structure and methods of forming the same

A wafer rotating apparatus includes a base, a carrying device, a first shaft gear, a power unit, a roller, a second shaft gear and a driving assembly. The base has an accommodating space which the carrying device is disposed in to accommodate the wafer. The first shaft gear is disposed on a side surface of the base. The power unit is assembled to a top of the base and connected to the first shaft gear. The roller is located under the carrying device and supports an edge of the wafer. The second shaft gear is disposed on the side surface of the base and connected to the roller. The driving assembly is connected between the first shaft gear and the second shaft gear. The power unit provides a power through the first gear, the driving unit and the second shaft gear to drive the roller to rotate the wafer.

Wafer rotating apparatus

Growing community of inventors

Hsinchu, Taiwan

Yuan-Hao Chang