Google Inc.

Altera Corporation

Tsinghua University

Omron Corporation

Yuan Hang Li

Hartwig Adam

Madhusudan K Iyengar

Teckgyu Kang

Wen-chou Vincent Wang

Woon-Seong Kwon

Jorge Padilla

Jia Wei Tam

Norman Paul Jouppi

Christopher Gregory Malone

Yuanlin Xie

Padam Jain

Daniel Holle

Sabrina Silk Billinghurst

Gregory Neiswander

Yan Yan

Jorge Taketoshi Furuya Mariche

Stefan Day Dierauf

Rasekh Rifaat

Ian Douglas Barlow

Charles Joseph Rosenberg

Selim Flavio Cinek

Sunny Goyal

Arif Huda

Rohan Ketan Shah

Remington C McElhaney

Taehee Lee

Connor Burgess

Vadali Mahadev

Bruce Euzent

Winson W S Chung

Maks Ovsjanikov

Teck-Gyu Kang

Michael Adam Cohen

Emad Samadiani

William F Edwards

Donald S Fritz

Myung June Lee

Erick Tuttle

Gregory Sizikov

Takayoshi Yamashita

Melanie Beauchemin

Aurora Marian Adkins

Woon Seong Kwon

Nan Ding

Sylvain Gelly

Jia H Deng

Ryan Takashi Chu

Shihong Lao

Haizhou Ai

Ping Chet Tan

Ken Beng Lim

Gyeong Sik Choi

Feini Zhang

Yingying Wang

Nicholas Stevens-Yu

Zhi Yang

Dylan Thomas Casano

Don Fritz

Michael Alexander Digman

Relly Brandman

Angela Park

Stephen John Tapper

Matthew Ng

A method of manufacturing a chip assembly comprises joining an in-process unit to a printed circuit board; reflowing a bonding material disposed between and electrically connecting the in-process unit with the printed circuit board, the bonding material having a first reflow temperature; and then joining a heat distribution device to the plurality of semiconductor chips using a thermal interface material ('TIM') having a second reflow temperature that is lower than the first reflow temperature. The in-process unit further comprises a substrate having an active surface, a passive surface, and contacts exposed at the active surface; an interposer electrically connected to the substrate; a plurality of semiconductor chips overlying the substrate and electrically connected to the substrate through the interposer, and a stiffener overlying the substrate and having an aperture extending therethrough, the plurality of semiconductor chips being positioned within the aperture.

Methods and heat distribution devices for thermal management of chip assemblies

In one example, a computing device includes one or more user input detection components, and one or more processors configured to receive an indication of a first user input detected by the one or more user input detection components, responsive to receiving the indication of the first user input, adjust a level of an attention buffer at a defined rate; responsive to determining that the level of the attention buffer satisfies a first threshold, prevent further interaction with a user interface of the computing device, responsive to determining that an indication of a second user input has not been received within a time period, adjust a level of the attention buffer, and responsive to determining that the level of the attention buffer satisfies a second threshold, allow further interaction with the user interface.

Automated pacing of vehicle operator content interaction

A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.

Cooling electronic devices in a data center

A weight optimized stiffener for use in a semiconductor device is disclosed herein. In one example, the stiffener is made of AlSiC for its weight and thermal properties. An O-ring provides sealing between a top surface of the stiffener and a component of the semiconductor device and adhesive provides sealing between a bottom surface of the stiffener and another component of the semiconductor device. The stiffener provides warpage control for a lidless package while enabling direct liquid cooling of a chip or substrate.

Weight optimized stiffener and sealing structure for direct liquid cooled modules

According to an aspect of the disclosure, an example microelectronic device assembly includes a substrate, a microelectronic element electrically connected to the substrate, a stiffener element overlying the substrate, and a heat distribution device overlying the rear surface of the microelectronic element. The stiffener element may extend around the microelectronic element. The stiffener element may include a first material that has a first coefficient of thermal expansion ('CTE'). A surface of the stiffener element may face toward the heat distribution device. The heat distribution device may include a second material that has a second CTE. The first material may be different than the second material. The first CTE of the first material of the stiffener element may be greater than the second CTE of the second material of the heat distribution device.

Display screen or portion thereof with an animated graphical user interface

Systems and methods for utilizing the dead space around the periphery of a chip for sealing a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. A groove member for receiving a sealing member may be applied to the top surface of the chip. The groove member may be directly deposited to the top surface or coupled thereto via an adhesive and/or epoxy. The groove member may be in the form of opposing sidewalls or a u-shaped structure each of which form a partial enclosure for receipt of the sealing member. The groove member may be located entirely within the dead space or at least partially within the dead space and partially within a central area in which the chip components are located. The sealing member may be an O-ring or a gasket.

Direct liquid cooling with O-ring sealing

Display screen or portion thereof with an animated icon

A device for direct liquid cooling is disclosed. The device includes a packaged assembly disposed on a substrate. The device also includes a metal channel layer having a plurality of channels disposed on top of the packaged assembly, and a top seal disposed on the metal channel layer. The top seal has at least one inlet and at least one outlet for direct liquid cooling. The metal channel layer includes copper or silver. The packaged assembly can also include silicon channels. In addition, the method of producing the device is also disclosed.

Device and method for direct liquid cooling via metal channels

A cooling system, for example, for rack mounted electronic devices (e.g., servers, processors, memory, networking devices or otherwise) in a data center. In various disclosed implementations, the cooling system may be or include a liquid cold plate assembly that is part of or integrated with a server tray package. In some implementations, the liquid cold plate assembly includes a base portion and a top portion that, in combination, form a cooling liquid flow path through which a cooling liquid is circulated and a thermal interface between one or more heat generating devices and the cooling liquid.

A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member that includes a first number of inlet ports and a second number of outlet ports that are in fluid communication with a cooling liquid flow path defined through the heat transfer member, the first number of inlet ports being different that the second number of outlet ports.

Growing community of inventors

Milpitas, CA, United States of America

Yuan Hang Li