Intel Corporation

Yuan-Chuan Steven Chen

Mayue Xie

Zhiyong Wang

Daniel R Bockelman

Md Asifur Rahman

Christopher John Brookreson

Described is an apparatus comprising: an input pad; an output pad; a wire, coupled to the input pad and the output pad, the wire positioned at a periphery of a semiconductor die, the wire extending substantially along a perimeter of the semiconductor die; and one or more diodes, coupled at various sections of the wire, and positioned along the perimeter of the semiconductor die and surrounding the semiconductor die.

Apparatus and method to monitor die edge defects

A diagnostic tool for testing an integrated circuit device directs a beam of laser energy to stimulate at least a portion of the device. In one mode, electromagnetic waves from said device may be detected at the same time in response to the stimulation. A processor collects image data and determines as a function of the collected image data whether the device has a defect. Other embodiments are described and claimed.

Growing community of inventors

Portland, OR, United States of America

Yuan-Chuan Steven Chen