Taiwan Semiconductor Manufacturing Comp. Ltd.

Weltrend Semiconductor Inc.

Yu-Yun Huang

Shang-Yun Hou

Sung-Hui Huang

Kuan-Yu Huang

Yu-Jen Cheng

Wen-Yao Chang

Shu Chia Hsu

Sen-Bor Jan

Tien-Yu Huang

Chun-Teh Chen

Yi Lun Shen

Ren Yi Chen

In an embodiment, an interposer has a first side, a first integrated circuit device attached to the first side of the interposer with a first set of conductive connectors, each of the first set of conductive connectors having a first height, a first die package attached to the first side of the interposer with a second set of conductive connectors, the second set of conductive connectors including a first conductive connector and a second conductive connector, the first conductive connector having a second height, the second conductive connector having a third height, the third height being different than the second height, a first dummy conductive connector being between the first side of the interposer and the first die package, an underfill disposed beneath the first integrated circuit device and the first die package, and an encapsulant disposed around the first integrated circuit device and the first die package.

Semiconductor die package and method of manufacture

A package assembly includes a package substrate including a first die that includes a photonic integrated circuit, a second die located on the first die, the second die including an electronic integrated circuit electrically connected to the photonic integrated circuit, and an interposer module on the package substrate, at least a portion of the interposer module being located on the first die and electrically connected to the photonic integrated circuit.

Photonic silicon spatial beam transformer integrated on 3DIC package and methods for forming the same

A power converter capable of performing over-voltage protection and over-temperature protection converts an input voltage into an output voltage. A power switch is connected in series with a primary winding between the input voltage and an input ground. A power controller with a multi-function pin controls the power switch to control a winding current through the primary winding. The power converter has a multi-purpose circuit with first and second resistors, a rectifier and a thermistor. A connection node makes the first and second resistors connected in series between two ends of an auxiliary winding. The rectifier and the thermistor are connected in parallel between the multi-function pin and the connection node. The power controller can perform over-voltage protection and over-temperature protection via the multi-purpose circuit and the multi-function pin.

Power converter, power controller, and control method capable of providing multiple protections

Growing community of inventors

Hsinchu, Taiwan

Yu-Yun Huang