Taiwan Semiconductor Manufacturing Comp. Ltd.

Yu-Young Wang

Ming-Fa Chen

Sen-Bor Jan

Victor Y Lu

Chung-En Kao

Wen-Cheng Yang

Chyi-tsong Ni

A cleaning device for removing contamination on a substrate holder used with an electroplating cell includes an arm, a cleaning agent supplier, a nozzle and a receiver. The cleaning agent supplier is coupled to the arm and configured to supply a cleaning agent. The nozzle is coupled to the cleaning agent supplier and configured to spray the cleaning agent onto the substrate holder to remove the contamination. The receiver is coupled to the arm and configured to receive the cleaning agent after the cleaning agent is sprayed onto the substrate holder.

Cleaning device for cleaning electroplating substrate holder

An apparatus and method for physical vapor deposition includes a magnetron having a plurality of electromagnets disposed between a base and a magnetic conductive plate. The magnetron includes a plurality of individually controlled electromagnets between a base and an electromagnetic plate. The magnetron controls the polarity and strength of current supplied to the respective electromagnets to generate magnetic fields that confine electrons to areas near a target material within the deposition chamber.

Apparatus and method for physical vapor deposition

A device includes a semiconductor substrate and a Metal-Oxide-Semiconductor (MOS) transistor. The MOS transistor includes a gate electrode over the semiconductor substrate, and a source/drain region on a side of the gate electrode. A source/drain contact plug includes a lower portion and an upper portion over the lower portion, wherein the source/drain contact plug is disposed over and electrically connected to the source/drain region. A gate contact plug is disposed over and electrically connected to the gate electrode, wherein a top surface of the gate contact plug is level with a top surface of the top portion of the source/drain contact plug. A Through-Substrate Via (TSV) extends into the semiconductor substrate. A top surface of the TSV is substantially level with an interface between the gate contact plug and the gate electrode.

Methods for forming through-substrate vias penetrating inter-layer dielectric

Through-substrate vias and methods for forming the same

Methods and devices for connecting a through via and a terminal of a transistor formed of a strained silicon material are provided. The terminal, which can be a source or a drain of a NMOS or a PMOS transistor, is formed within a substrate. A first contact within a first inter-layer dielectric (ILD) layer over the substrate is formed over and connected to the terminal. A through via extends through the first ILD layer into the substrate. A second contact is formed over and connected to the first contact and the through via within a second ILD layer and a contact etch stop layer (CESL). The second ILD layer is over the CESL, and the CESL is over the first ILD layer, which are all below a first inter-metal dielectric (IMD) layer and the first metal layer of the transistor.

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Taipei, Taiwan

Yu-Young Wang