Bioalliance C.v.

Taiwan Semiconductor Manufacturing Comp. Ltd.

Abgenomics International Inc.

Altrubio Inc.

Yu-Ying Tsai

Shih-Yao Lin

Leewen Lin

Shih-Ming Chen

Rong-Hwa Lin

Kuo-Wei Lin

Chiu-Chen Huang

Yu-Chi Hsieh

Shu-Hua Lee

Feng-Lin Chiang

Li-An Hu

Provided herein are tetravalent antibodies that specifically bind to human PSGL-1. Unlike bivalent antibodies, these tetravalent antibodies contain a dimer of two monomers, with each monomer comprising two light chain variable (VL) domains and two heavy chain variable (VH) domains. This format allows for cross-linker/FcR-expressing cell-independent tetravalent antibodies against PSGL-1 that show enhanced efficacy as compared to bivalent PSGL-1 antibodies. These tetravalent antibodies can be used in a variety of diagnostic and therapeutic methods, including without limitation treating T-cell mediated inflammatory diseases, transplantations, and transfusions.

Tetravalent anti-PSGL-1 antibodies and uses thereof

The present disclosure provides anti-folate receptor alpha (FRA) antibody-drug conjugates comprising a hydrophilic self-immolative linker. The present disclosures further provide compositions and methods for treating cancers.

Anti-folate receptor alpha (FRA) antibody-drug conjugates and methods of using thereof

The present invention provides antibodies (such as chimeric and humanized antibodies) specifically bind to an epitope on CD43 and CEA expressed on nonhematopoietic cancer cells. In addition, the present invention also provides use of the antibodies described herein for diagnostic and therapeutic purposes.

Antibodies recognizing a carbohydrate containing epitope on CD-43 and CEA expressed on cancer cells and methods using same

Disclosed herein are intermediate and solder bump structures. In one embodiment, a structure comprises a primary solder column comprising primary solder material and configured to electrically contact a bonding pad on a semiconductor substrate. The structure also comprises at least one secondary solder column comprising secondary solder material in electrical contact with the primary solder column, the at least one secondary column having a height and volume less than a height and volume of the primary solder column. In such structures, the primary solder column is further configured to form a primary solder bump comprising the primary solder material and at least a portion of the secondary solder material through cohesion from the at least one secondary solder column when the intermediate structure undergoes a reflow process.

Solder bump and related intermediate structure having primary and secondary portions and method of manufacturing same

Disclosed herein are a method of manufacturing a solder bump on a semiconductor device, a solder bump structure formed on a substrate, and an intermediate solder bump structure. In one embodiment, the method includes creating a bonding pad over a semiconductor substrate, and placing a mask layer over the substrate and the bonding pad. The method also includes forming an opening in the mask layer having a primary solder mold and at least one secondary solder mold joined with the primary mold, where the opening exposes a portion of the bonding pad. In this embodiment, the method further includes filling the primary solder mold and the at least one secondary solder mold with solder material to form corresponding primary and at least one secondary solder columns in electrical contact with the bonding pad. The method also includes removing the mask layer after the filling of the solder molds with the solder material. The method still further includes reflowing the solder material to form a primary solder bump from the solder material of the primary solder column and at least a portion of the solder material from the at least one secondary solder column through cohesion of the solder material from the at least one secondary solder column to the primary solder column when melted.

IC chip solder bump structure and method of manufacturing same

Growing community of inventors

Taipei, Taiwan

Yu-Ying Tsai