United Microelectronics Corp.

Yu-Ying Huang

En-Chiuan Liou

Yi-Jing Wang

Mei-Chen Chen

Jen-Hsiu Li

Ya-Ling Chen

Chi-Ming Huang

In this disclosure, a mark segmentation method and a method for manufacturing a semiconductor structure applying the same are provided. The mark segmentation method comprises the following steps. First, a plurality of segments having a width Wand separated from each other by a space Sformed on a substrate are identified by a processor. Thereafter, a plurality of marks are set over the segments by the processor. This step comprises: (1) adjusting a width Wof each one of the marks being equal to m(W+S)+Wor m(W+S)+Sby the processor, wherein m is an integer; and (2) adjusting a space Sof adjacent two of the marks by the processor such that WS=n(W+S), wherein n is an integer.

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Tainan, Taiwan

Yu-Ying Huang