Industrial Technology Research Institute

Yu-Yang Chang

Cheng-Chung Lee

Jyh-Rong Sheu

Liang-You Jiang

Chun-Tao Lee

Pao-Ming Tsai

Jia-Chong Ho

Wei-Yi Lin

Ching-Hsun Chao

Jane-Hway Liao

Yu-Jen Chen

Yu-Wu Wang

Hua-Chi Cheng

Ming-Chun Hsiao

Hsiao-Fen Wei

Biing-Nan Lin

Dong-Sen Chen

Shih-Chieh Hsu

Chen-Pang Kung

Chung-Wen Wu

Yi-Ping Lin

Ming-Hung Lin

Lih-Hsiung Chan

Hung-Yuan Li

Yu-Han Chien

Wen-Kuei Huang

Kuang-Chung Chen

Janglin Chen

Ying-Hsien Cheng

Yun-Chiao Hsiao

Shin-Chiuan Jiang

Chung-I Lee

Chen-Chung Lee

Liang-You Chiang

Liang-Yu Chiang

Hsiao-Yen Lee

An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, gas barrier structures, micro-structures, and a filler layer is provided. The second substrate is located above the first substrate. The environmental sensitive electronic device is located on the first substrate. The gas barrier structures may be located between the first substrate and the second substrate and surround the environmental sensitive electronic device. The gas barrier structures have a first height. The micro-structures may be located between the first substrate and the second substrate and have a second height. A ratio of the second height to the first height ranges from 1/250 to 1/100. The filler layer may be located between the first substrate and the second substrate and covers the gas barrier structures and the environmental sensitive electronic device. A manufacturing method of an environmental sensitive electronic device package is also provided.

Environmental sensitive electronic device package and manufacturing method thereof

A gas barrier substrate including a first gas barrier layer, a substrate, and a second gas barrier layer is provided. The first gas barrier layer has a central bonding surface bonded with the substrate and a peripheral boding surface surrounding the central bonding surface. The second gas barrier layer entirely covers the substrate and the first gas barrier layer. The second gas barrier layer is bonded with the substrate and the peripheral boding surface of the first gas barrier layer, wherein a minimum distance from an edge of the substrate to an edge of the first gas barrier layer is greater than a thickness of the first gas barrier layer.

Gas barrier substrate and organic electro-luminescent device

The invention provides a method for patterning a flexible substrate. The method for patterning a flexible substrate includes providing a carrier substrate. A release layer is formed on the carrier substrate. A flexible substrate film is formed on the release layer. A plurality of UV blocking mask patterns is formed covering various portions of the flexible substrate film and the release layer. A UV lighting process is performed to expose the flexible substrate film and the release layer not covered by the UV blocking mask patterns, to a UV light. A debonding step is performed so that the various portions of the flexible substrate film directly above the various portions of the release layer, which were not exposed to the UV light, are separated from the carrier substrate.

Method for patterning flexible substrate

Method for isolating a flexible film from a support substrate and method for fabricating an electronic device are provided. The method for isolating a flexible film from a support substrate includes providing a substrate with a top surface. A surface treatment is subjected to the top surface of the substrate, forming a top surface with detachment characteristics. A flexible film is formed on the top surface with detachment characteristics. The flexible film within the top surface with detachment characteristics is cut and isolated.

Method for isolating flexible film from support substrate

Fabricating method of gas barrier substrate, organic electro-luminescent device and packaging method thereof

A method for isolating a flexible substrate from a support substrate and method for fabricating a flexible electronic device are provided. The method for isolating a flexible substrate from a support substrate includes providing a flexible substrate with a bottom surface. A surface treatment is subjected to the bottom surface of the flexible substrate, forming a bottom surface with detachment characteristics. The flexible substrate is fixed on the support substrate by means of an adhesive layer, wherein the bottom surface with detachment characteristics faces the support substrate. The flexible substrate is cut and isolated from the support substrate.

Method for isolating flexible substrate from support substrate

The invention provides a transferring apparatus for a flexible electronic device and method for fabricating a flexible electronic device. The transferring apparatus for the flexible electronic device includes a carrier substrate. A release layer is disposed on the carrier substrate. An adhesion layer is disposed on a portion of the carrier substrate, surrounding the release layer and adjacent to a sidewall of the release layer. A flexible electronic device is disposed on the release layer and the adhesion layer, wherein the flexible electronic device includes a flexible substrate.

Transferring structure for flexible electronic device and method for fabricating flexible electronic device

A pixel unit including a first sub-pixel is disclosed. The first sub-pixel includes a first display medium, a second display medium, a first driving device, and a second driving device. The first driving device drives the first display medium. The second driving device drives the second display medium.

Pixel unit and display device utilizing the same

Roll-to-roll printing apparatuses are disclosed. The roll-to-roll printing apparatus includes a printing device with a squeegee moving along a first direction transferring a pattern of a stencil to a roll of working pieces. A sending roller and a receiving roller are disposed on both sides of the printing device. The roll of working pieces is rolled along a second direction to a printing stage of the printing device. An alignment device is disposed corresponding to a position of the stencil and the roll of working pieces. A drying device is disposed on one side of the printing device and may be on the same side with the receiving roller, wherein the drying device cures the patterns on the roll of working pieces.

Roll-to-roll printing apparatuses

An electroluminescent device includes a first electrode layer, a phosphor layer on the first electrode layer, a layer with permanent accumulated charges on the phosphor layer, and a second electrode layer on the layer with permanent accumulated charges. By the addition of the layer with permanent accumulated charges, an external driving voltage applied to the luminescent device can be reduced.

Electroluminescent device

A method for fabricating a cathode plate of a field emission display is disclosed. A patterned electrode layer is formed on a surface of the substrate, and emitters for absorbing a light source are formed on the patterned electrode layer. Next, a dielectric layer is formed over the substrate, and a patterned gate layer is formed on the dielectric layer. Thereafter, a backside exposure process is carried out using the emitters as a mask, and portions of the dielectric layer not masked by the emitters react with a light used in the backside exposure process. Next, portions of the dielectric layer not exposed to the light and portions of the gate layer are removed to form via holes and gate holes.

Field emission display device and cathode plate thereof

A planar light unit provided with field emitters and a method for fabricating the same. According to the present invention, the planar light unit has a first substrate, a plurality of first conductive strips, a plurality of second conductive strips, a plurality of field emitters, a second substrate and a fluorescent film. The plurality of first conductive strips are formed over the first substrate, and the plurality of second conductive strips are formed over the first substrate and interposed inbetween the plurality of first conductive strips. The plurality of field emitters are formed in proximity of the plurality of first conductive strips. The second substrate is provided to be attached to and spaced apart from the first substrate to form a chamber therebetween, whereas a fluorescent film is formed over the interior surface of the second substrate facing the plurality of field emitters.

Planar light unit using field emitters and method for fabricating the same

A triode field emission display is provided. It utilizes the electrical characteristics that an edge structure may raise the electric field intensity to expose an edge of a cathode plate through an opening of a gate layer, thereby forming the edge structure at an emitter to raise the electric field intensity. Therefore, reduction of driving voltage is achieved.

Triode field emission display

Growing community of inventors

Tainan, Taiwan

Yu-Yang Chang