Asm Technology Singapore Pte Ltd

Yu Xing Cao

Gary Peter Widdowson

Ying Liu

Kai Siu Lam

Wing Chiu Lai

Kin Fung Yu

A pick arm for a pick and place apparatus for semiconductor devices, the pick arm comprising first and second ends along a longitudinal axis of the pick arm, and a pick tool located at the first end of the pick arm for picking up semiconductor devices. The pick arm further comprises a winged part extending in a direction transverse to the longitudinal axis between the first and second ends of the pick arm, wherein the winged part comprising a sloping surface. The sloping surface is inclined between a top portion and a bottom portion of the winged part such that the sloping surface is nearer to the longitudinal axis at the top portion than at the bottom portion of the winged part.

Growing community of inventors

Hong Kong, China

Yu Xing Cao