Corning Incorporated

Yu Xiao

Jin Su Kim

Kiat Chyai Kang

Govindarajan Natarajan

Sue Camille Lewis

Timothy Michael Gross

Heather Debra Boek

Lu Zhang

Jesse Kohl

Dipakbin Qasem Chowdhury

Chunhe Zhang

Liying Zhang

Jean-Marc Martin Gerard Jouanno

Hung Cheng Lu

Kurt Edward Gerber

Jean-Marc Martin Jouanno

A wafer- or panel-level encapsulated package comprises a glass substrate comprising a glass cladding layer () fused to a glass core layer (), the glass substrate comprising a cavity (), wherein the glass cladding layer has a higher etch rate in an etchant than the glass core layer. The wafer- or panel-level encapsulated package further comprises a microelectronic component () disposed in the cavity, and an encapsulant () sealed to the glass substrate such that the microelectronic component is encapsulated within the cavity. Methods for forming the wafer- or panel-level encapsulated package, including etching a cavity into a glass substrate, depositing a microelectronic component into the cavity, and sealing an encapsulant to the glass substrate such that the microelectronic component is encapsulated within the cavity are also provided.

Glass carrier for die-up fan-out packaging and methods for making the same

Methods for manufacturing glass articles having a target effective coefficient of thermal expansion CTEaveraged over a temperature range comprise selecting a glass core composition having an average core glass coefficient of thermal expansion CTEthat is greater than the target effective CTEand a glass clad composition having an average clad glass coefficient of thermal expansion CTEthat is less than the target effective CTE; and manufacturing a glass laminate comprising a glass core layer formed from the glass core composition and two or more glass cladding layers fused to the glass core layer, each of the two or more glass cladding layers formed from the glass clad composition such that a ratio of a thickness of the glass core layer to a total thickness of the two or more glass cladding layers is selected to produce the glass laminate having an effective coefficient of thermal expansion CTEthat is within ±0.5 ppm/° C. of the target effective CTE.

Glass carriers for fan-out packaging having target coefficients of thermal expansion and methods for making the same

A method of fan-out processing includes providing or obtaining a fused glass laminate sheet or wafer having a core layer and a first clad layer and a second clad layer, the core layer comprising a core glass having a core glass coefficient of thermal expansion α, the first clad layer and the second clad layer each comprising a clad glass having a clad glass coefficient of thermal expansion α, where α>α; affixing integrated circuit devices to the second clad layer of the laminate sheet or wafer; forming a fan-out layer on or above the integrated circuit devices; and removing some of the first clad layer to decrease warp of the sheet or wafer with integrated circuit devices and a fan-out layer thereon. A method of producing a laminate sheet or wafer having a selected CTE is also disclosed.

Low warp fan-out processing method and production of substrates therefor

A method of fan-out processing includes providing or obtaining a fused glass laminate sheet or wafer having a core layer and a first clad layer and a second clad layer, the core layer comprising a core glass having a core glass coefficient of thermal expansion &#x3b1;, the first clad layer and the second clad layer each comprising a clad glass having a clad glass coefficient of thermal expansion &#x3b1;, where &#x3b1;&#x3e;&#x3b1;; affixing integrated circuit devices to the second clad layer of the laminate sheet or wafer; forming a fan-out layer on or above the integrated circuit devices; and removing some of the first clad layer to decrease warp of the sheet or wafer with integrated circuit devices and a fan-out layer thereon. A method of producing a laminate sheet or wafer having a selected CTE is also disclosed.

A glass-polymer laminate structure includes a flexible glass substrate having a thickness of no more than about 0.3 mm. A polymer layer is laminated to a surface of the flexible glass substrate having a coefficient of thermal expansion (CTE) that is at least about 2 times a CTE of the flexible glass substrate. The polymer layer is laminated to the surface of the flexible glass substrate after thermally expanding the polymer layer to provide the flexible glass substrate with an in-plane compressive stress of at least about 30 MPa along a thickness of the flexible glass substrate.

Strengthened thin glass-polymer laminates

A laminated glass structure comprising a non-glass substrate and a glass sheet bonded to the non-glass substrate to form the laminated glass structure, wherein the laminated glass structure withstands a ball drop test wherein a 535 g stainless steel ball is dropped from a height of 0.8 m onto the laminated glass structure, with the glass sheet being impacted by the ball. The glass sheet has a thickness such that the glass sheet exhibits, without cracking, deformation to adapt to any shape change of the non-glass substrate as imparted by the ball of the ball drop test.

Strengthened laminated glass structures

A method of forming a laminated glass structure includes introducing a continuous ribbon of flexible glass substrate having a thickness of no greater than about 0.3 mm to a substrate material. The substrate material has a coefficient of thermal expansion (CTE) that is greater than that of the flexible glass substrate. The flexible glass substrate is laminated to the substrate material at an elevated temperature. The substrate material is cooled to introduce a compressive stress across a thickness of the flexible glass substrate.

Methods of forming laminated glass structures

A laminate including a glass sheet and a first polymer layer laminated to a first surface of the glass sheet. The glass sheet has a thickness of from 5 to 500 microns, and the first polymer layer provides a coating factor (F) to the glass sheet. The laminate is curved so that a second surface of the glass sheet is disposed in a concave shape; and the coating factor (F) is less than 1. A second polymer layer may be disposed on the second surface of the glass sheet, and its properties may be chosen relative to those of the first polymer layer so as to reduce the maximum principle stress-due to a bending moment-in the glass as compared to a bare glass sheet.

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Pittsford, NY, United States of America

Yu Xiao