Industrial Technology Research Institute

Richtek Technology Corporation

Yu-Wen Hsu

Chao-Ta Huang

Chung-Yuan Su

Shih-Chieh Lin

Lung-Tai Chen

Chin-Fu Kuo

Tzung-Ching Lee

Chih-Yuan Chen

Chien-Nan Yeh

Lu-Po Liao

Sheah Chen

Che-Kai Yeh

Ying-Che Lo

Tzong-Che Ho

Chia-Yu Wu

Shih-Ting Lin

Li-Chi Pan

Hsin-Tang Chien

Li-Tao Teng

Jing-Yuan Lin

Feng-Chia Hsu

Bor-Shiun Lee

Ming-Fa Chen

Sheng-Ren Chiu

Chieh-Ling Hsiao

Yu-Chun Hsu

Jen-Chieh Li

Lu-Pu Liao

Bo-Kai Chao

A vertically integrated micro-bolometer includes an integrated circuit chip, an infrared sensing film, and a metal bonding layer. The integrated circuit chip includes a silicon substrate, a circuit element, and a dielectric layer disposed on the silicon substrate. The infrared sensing film includes a top absorbing layer, a sensing layer, and a bottom absorbing layer. The sensing layer is disposed between the top absorbing layer and the bottom absorbing layer. Materials of the top absorbing layer, the sensing layer, and the bottom absorbing layer are materials compatible with a semiconductor manufacturing process. The metal bonding layer connects the dielectric layer on the silicon substrate in the integrated circuit chip and the bottom absorbing layer of the infrared sensing film to form a vertically integrated micro-bolometer. In one embodiment, the infrared sensing film is divided into a central sensing film, a surrounding sensing film, and a plurality of connecting portions by a plurality of slots. The surrounding sensing film surrounds the central sensing film. Each of the connecting portions connects the surrounding sensing film and the central sensing film. A central distance from the bottom absorbing layer of the central sensing film to the silicon substrate is substantially equal to a surrounding distance from the bottom absorbing layer of the surrounding sensing film to the silicon substrate.

Vertically integrated micro-bolometer and manufacturing method thereof

The disclosure relates to a microelectromechanical apparatus including a substrate, a stationary electrode, a movable electrode, and a heater. The substrate includes an upper surface, an inner bottom surface, and an inner side surface. The inner side surface surrounds and connects with the inner bottom surface. The inner side surface and the inner bottom surface define a recess. The stationary electrode is disposed on the inner bottom surface. The movable electrode covers the recess. The movable electrode, the inner bottom surface, and the inner side surface define a hermetic chamber. The heater is disposed on the movable electrode and located above the hermetic chamber.

Microelectromechanical apparatus having hermitic chamber

A pressure sensor with calibration device includes a casing, a diaphragm, a sensing element, a medium, and at least one calibration element. The diaphragm is disposed on the casing, wherein the casing and the diaphragm define an accommodating space. The sensing element is disposed in the casing. The medium is filled in the accommodating space and in contact with the sensing element. The at least one calibration element is adjustably disposed at the casing and extended into the accommodating space to be in contact with the medium, wherein when the at least one calibration element is moved relative to the casing in a direction toward the accommodating space or in a direction away from the accommodating space, the at least one calibration element changes the pressure applied to the medium. The pressure sensor with calibration device adjusts the pressure value sensed by the sensing element via the calibration element.

Pressure sensor with calibration device and calibration method thereof

A calibration system for calibrating pressure sensor comprises communication pipe, base, inlet valve, outlet valve, pump, inlet pipe, heater and reference pressure sensor. The communication pipe has first and second openings. The base comprises chamber body and outlet being disposed at the chamber body. The inlet valve is disposed at the first opening. The chamber body is connected to the second opening so as to define a space between the inlet valve and the outlet valve. The heater is to heat a fluid in the space. The reference pressure sensor is configured to measure a pressure of the fluid. The at least one target pressure sensor is detachably mounted on the chamber body via the base so as to measure the pressure of the fluid in the space.

Calibration system for pressure sensor

A vibration sensor with monitoring function is provided, which includes a substrate, a microelectromechanical vibration sensor chip and an application-specific integrated circuit chip. The microelectromechanical vibration sensor chip is disposed on the substrate and detects a vibration applied to an object to generate a plurality of vibration signals. The application-specific integrated circuit chip is disposed on the substrate and electrically connected to the microelectromechanical vibration sensor chip, which includes a sampling module, a transform module and an analysis module. The sampling module receives and converts the vibration signals into a plurality of digital signals, and filters the digital signals to generate a plurality of time-domain data. The transform module transforms the time-domain data into a frequency-domain data according to a predetermined number. The analysis module executes a comparison process to compare the frequency-domain data with a predetermined spectrum feature table and generates a notification signal according to the comparison result.

Vibration sensor with monitoring function and vibration signal monitoring method thereof

An apparatus with two anchors including a housing, a movable element, and a rotary element is provided. The housing includes a first expansion unit, a second expansion unit, and a linkage. First alignment structures are disposed in the movable element and anti-rotation structures are disposed in the linkage. When the movable element and the rotary element enter the housing from two ends and are coupled along an axis, the movable element and the rotary element can approach each other to expand the first expansion unit and the second expansion unit to form two anchors. The apparatus with two anchors secures a sensor in a variety of environments such as walls or machines. When the apparatus with two anchors fixes a sensor in a hole of a stamping machine, the impact force does not cause stress concentration on the sensor so as to improve the reliability of the sensor.

Apparatus with two anchors

A ball screw with force sensor in radial direction including a screw rod, a screw nut, a plurality of balls, and a force sensor is provided. The screw nut has a cavity. The cavity is extended along a radial direction from an outer surface of the screw nut. The force sensor is disposed in the cavity of the screw nut, and the force sensor includes a stationary base and an elastic component. The stationary base includes a displacement restraint, and the elastic component includes a contact end and a fixed end. The displacement restraint is coupled to the cavity to prevent the stationary base from being displaced in the radial direction for fixing stationary base firmly in the cavity. The fixed end is connected to the stationary base, and the contact end contacts a bottom surface of the cavity in order to sense a force along the radial direction.

Ball screw with force sensor in radial direction

A MEMS device includes a substrate, at least one anchor disposed on the substrate, a movable stage, a sensing chip disposed on the movable stage, and at least one elastic member connected with the movable stage and the anchor. The movable stage includes at least one electrode and at least one conductive connecting layer. The sensing chip includes at least one electrical interconnection connected with the conductive connecting layer. The elastic member includes at least one first electrical channel, a second electrical channel and an electrical insulation layer disposed between the first electrical channel and the second electrical channel. The first electrical channel is electrically connected with the electrical interconnection, and the second electrical channel is electrically connected with the electrode.

MEMS device with movable stage

A MEMS apparatus with adjustable spring includes a central portion, a peripheral portion and at least one spring. The peripheral portion surrounds the central portion and is spaced apart from the central portion. The spring includes a peripheral section, an outward extension section and a central section. The peripheral section is connected to the outward extension section. An amount of thermal expansion per unit temperature change of the outward extension section is greater than that of the peripheral section or greater than that of the central section.

Microelectromechanical system (MEMS) apparatus with adjustable spring

A micro-electromechanical temperature control system including a micro-electromechanical apparatus is provided. The micro-electromechanical apparatus includes a heater and a thermal reservoir. A specific heat capacity of the thermal reservoir is greater than a specific heat capacity of the heater, so that a heating time and a heating frequency of the heater are reduced to save electrical power consumption. The micro-electromechanical temperature control system is adapted for a micro-electromechanical sensor that is required to be controlled at an operating temperature, such as a gas sensor.

Micro-electromechanical temperature control system with thermal reservoir

An adjustable sensing capacitance microelectromechanical system (MEMS) apparatus includes an ASIC and a sensing component. The ASIC includes a top surface, a readout circuit and a plurality of electrical switches. The sensing component, configured to sensing physical quantity, includes a fixed electrode and a movable electrode. The fixed electrode includes a plurality of electrode units. The movable electrode is able to be moved relative to the fixed electrode. The electrical switches are respectively and electrically coupled to the electrode units so as to control a working status of each of the electrode units, thereby changing a sensing capacitance of the MEMS sensor.

Adjustable sensing capacitance microelectromechanical system (MEMS) apparatus

An interaction force detection apparatus includes a sensor, a driving element, a moving element, and a connecting element. The connecting element is connected to the driving element and the sensor. The driving element is adapted to interact with the moving element, so as to generate a pair of forces. The pair of forces includes a first force and a second force, and a magnitude of the first force is equal to that of the second force. The sensor detects the first force exerted on the driving element, and the second force is exerted on the moving element to generate a movement.

Interaction force detection apparatus

A MEMS apparatus for thermal energy control including a sensor and an IC chip is provided. The sensor includes a heating device for heating a sensing element and a detecting device for detecting a physical quantity. The IC chip includes a memory unit for storing a target value of the sensing element and a data processing unit for convert the physical quantity to a converted value, where a gap value is defined by subtracting the converted value from the target value. Besides, a control unit of the IC chip sets a parameter value according to the gap value, and a driving unit adjusts a quantity of thermal energy generated by the heating device according to the parameter value to reduce heating time and frequency of the heating device thereby reducing electrical power consumption. The MEMS apparatus is applicable to MEMS sensors requiring controlled operating temperature, such as a gas sensor.

Micro-electromechanical apparatus for thermal energy control

A MEMS apparatus having measuring range selector including a sensor and an IC chip is provided. The sensor includes a sensing device. The IC chip includes a voltage range selector, an analog front end, a control device and an A/D converter. The sensing device is configured to detect the physical quantity and generate a sensing voltage. The voltage range selector is configured to select a sub-voltage range having a first upper-bound and a first lower-bound. The analog front end is configured to receive the sensing voltage and output a first voltage. The A/D converter has a full scale voltage range having a second lower-bound and a second upper-bound. A ratio of the full scale voltage range to the sub-voltage range is defined as a gain factor. A difference obtained by subtracting the first lower-bound from the first voltage is defined as a shift factor. The control device is configured to adjust the first voltage to the second voltage according to the gain factor and the shift factor.

Microelectromechanical apparatus having a measuring range selector

A MEMS apparatus includes a substrate, a cover disposed on the substrate, a movable mass disposed on the substrate, and an impact absorber disposed on the cover. The impact absorber includes a restraint, a stationary stopper disposed on a lower surface of the cover, a movable stopper, elastic elements connecting the restraint and the movable stopper, a supporting element connecting the restraint and the stationary stopper, and a space disposed between the stationary stopper and the movable stopper. The impact absorber is adapted to prevent the movable mass from impacting the cover. In addition, the supporting element may be made of an electrical insulation material to reduce electrostatic interaction between the movable mass and the movable stopper.

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Tainan, Taiwan

Yu-Wen Hsu