Molex Corporation

Industrial Technology Research Institute

Kaohsiung Medical University

Jm Material Technology Inc.

Yu-Wen Chen

Nai K Wong

Cherng-Chyi Tzeng

Yeh-Long Chen

Wen-Fa Lin

Jih-Chen Huang

Liu-Yuan Chen

Pei-Jung Lu

Hsueh-Ying Chen

Li-Fang Lu

The invention provides a photocatalytic structure comprising a carrier and a photocatalytic film formed on the carrier, in which the photocatalytic film comprises titanium dioxide with shape of rhombus particles. The titanium dioxide particle has anatase structure. The titanium dioxide particle is rhombus with a major axis 10-15 nm and minor axis 3-6 nm. The photocatalytic film which is formed by titanium dioxide with shape of rhombus particles has a high overall photocatalytic activity so that the effects of stainproofing and self-cleaning can be improved. The invention also relates to a method for manufacturing photocatalytic sol-gels.

Photocatalytic structure and method for manufacturing photocatalytic sol-gels

Disclosed herein are novel 4-anilinofuro[2,3-b]quinoline derivatives of formula (I): or a pharmaceutically acceptable salt thereof,wherein each of the substituents is given the definition as set forth in the Specification and Claims. Also disclosed are the preparation processes of these derivatives and their uses in the manufacture of pharmaceutical compositions and in the treatment of cancers.

4-anilinofuro[2,3-b]quinoline derivatives, their preparation processes, and pharmaceutical compositions comprising the same

A method for preparing polyether glycol is disclosed. An ester end-capped polyalkylene ether and an alcohol are subjected to alcoholysis at a temperature of 35.degree.-150.degree. C. and a pressure of 1-10 atm in the presence of a mixed metal oxide as a catalyst. The mixed metal oxide includes an alkaline earth metal oxide and at least one component selected from alumina, silica, and zinc oxide.

Method for preparing hydroxy group end-capped polyether glycols

An ejector mechanism is provided for ejecting an IC card from a header connector which has a mating end, a terminating end and first and second opposite sides extending between the ends. A generally L-shaped ejector frame is adapted to be mounted about the header connector with a base leg of the L-shaped frame along the terminating end of the header connector and a side leg along one side of the header connector. The side leg has a channel therein. An ejector lever is pivotally mounted on at least one of the header connector or the ejector frame and has a first lever end and a second lever end. The second lever end is adapted to eject the IC card from the header connector. An elongated push-rod is reciprocally mounted in the channel and has a first rod end pivotally associated with the first lever end of the ejector lever and a second rod end for manual actuation to effect pivoting of the eject lever and ejection of the IC card. The ejector frame is adapted to be mounted with the side leg thereof along either the first or second opposite sides of the header connector. Therefore, the ejector frame and push-rod can be used as either a 'right-hand' or a 'left-hand' ejector mechanism without altering the header connector.

Universal ejector mechanism for an IC card connector apparatus

An electrical connector is provided for surface mounting along an edge of a circuit board in an edge straddling configuration. The circuit board has a plurality of contact pads spaced along opposite faces of the board near the edge thereof. The connector includes a dielectric housing and a plurality of terminals mounted on the housing with solder tails projecting from the housing generally in two rows to define an elongate board-receiving mouth for receiving the edge of the circuit board. The contact pads are adapted to receive soft solder paste thereon prior to insertion of the board into the mouth between the two rows of solder tails. The solder tails of the terminals are configured for receiving the circuit board at a first angular orientation wherein minimal contact force is effected between the solder tails and the contact pads to prevent any substantial wiping away of the solder paste from the contact pads and a second angular orientation wherein substantial contact force is effected between the solder tails and the contact pads in a direction generally normal to the faces of the circuit board. Therefore, the solder paste remains in an interface area at each contact pad and its respective solder tail.

Growing community of inventors

Taipei, Taiwan

Yu-Wen Chen