Chiun Mai Communication Systems, Inc.

National Yang Ming Chiao Tung University

Inventec Appliances Corporation

Inventec Appliances (pudong) Corporation

Inventec Appliances (shanghai) Co., Ltd.

Yu-Wei Chang

Shu-Yang Tu

Albert Chihchieh Yang

Shih-Jen Tsai

A dual-band antenna includes a first conductive portion, a ground layer, a ground portion, a second conductive portion and a third conductive portion. The first conductive portion has a resonant cavity. The ground portion extends from the ground layer toward the first conductive portion. The second conductive portion extends from the ground layer toward the first conductive portion. The third conductive portion extends from the ground layer toward the first conductive portion. The second conductive portion and the third conductive portion are disposed symmetrically with respect to the ground portion.

Dual-band antenna and antenna module using the same

A method for determining whether there is an abnormality in a brain includes steps of: receiving a to-be-determined (TBD) 3D brain image; implementing the calibration procedure on the TBD 3D brain image; generating a first TBD image of WM, a second TBD image of GM, and a third TBD image of CSF based on a multi-voxel pattern of the TBD 3D brain image; and inputting the first TBD image of WM into a first DNN model, the second TBD image of GM into a second DNN model, and the third TBD image of CSF into a third DNN model to determine whether there is an abnormality in the white matter, the gray matter and the cerebrospinal fluid, respectively.

Method for training model of deep neural network, and method and system using the model to determine whether there is abnormality in brain

A thin-profile composite heat dissipating structure for a heat-generating electronic device includes a heat sink and a heat pipe, the heat sink includes a first housing, a first heat dissipation liquid, and a gas. The first housing is sealed to form a first cavity, the first heat dissipation liquid and the gas are received in the first cavity. The heat pipe is connected to the first housing and a wick structure to allow the return of the condensed heat dissipation liquid by capillary action is disposed elsewhere. An electronic device using the structure is also provided.

Composite heat dissipating structure and electronic device using the same

A heat sink allowing a reduced thickness of an electronic device includes a housing, a wick structure, and a heat transfer fluid. The housing, comprising an upper housing and a lower housing, are opposite and form a sealed cavity. The wick structure and the heat transfer fluid are received in the cavity, the liquid absorbing heat and becoming gaseous upon reaching a certain temperature. The area of the upper housing is larger than the area of the lower housing. The upper housing forms a protrusion with respect to an edge of the lower housing. An electronic device using the heat sink is also provided.

Heat sink and electronic device using same

A heat dissipation structure comprises a channel structure and a cooling material received and sealed in the channel structure. The cooling material is a low-boiling-point electrical insulating fluid. The channel structure is made of an electrical insulating material. The channel structure comprises an evaporation portion, a condenser portion, and at least one channel connecting the evaporation portion and the condenser portion. An electronic device using the heat dissipation structure is also provided.

Growing community of inventors

Taipei, Taiwan

Yu-Wei Chang