Innolux Corporation

Yu-Tsung Liu

Te-Yu Lee

Chao-Hsiang Wang

Chung-Wen Yen

Wei-Ju Liao

Po-Hsin Lin

Wei-Lin Wan

Hui-Ching Yang

Kuan-Yu Chiu

Chao-Yin Lin

Chandra Lius

Chien-Ta Huang

Cheng-Hsueh Hsieh

I-An Yao

Minoru Shibazaki

Tao-Sheng Chang

Hsing-Yi Liang

I-Che Lee

Ting-Yeh Chi

Ming-Chih Chen

Te-Yu Le

An electronic device having a sensing region and a non-sensing region includes a sensing element, a first light shielding layer and a second light shielding layer. The sensing element is disposed corresponding to the sensing region. The first light shielding layer includes at least one first opening corresponding to the sensing element. The second light shielding layer includes at least one second opening overlapped with the first opening. In a cross-section view, a boundary between the sensing region and the non-sensing region is at an outer side of an edge of a portion of the first light shielding layer, and a horizontal distance between an edge of a portion of the second light shielding layer and the sensing element is greater than or equal to a vertical distance between the portion of the second light shielding layer and the sensing element in a top-view direction of the electronic device.

Electronic device including sensing element

A sensing device is provided. The sensing device includes a driving substrate, a sensing module, and a plurality of bonding pads. The driving substrate includes a first substrate and a plurality of driving circuits disposed on the first substrate. Each of the driving circuits includes a plurality of thin-film transistors. The sensing module is bonded to the driving substrate, and the sensing module includes a second substrate and a plurality of sensing elements disposed on the second substrate. The sensing module is bonded to the driving substrate through the bonding pads. In addition, each of the driving circuits is electrically connected to at least one of the sensing elements. The wavelength of light penetrating the first substrate is greater than or equal to 4 μm and less than or equal to 10 μm. An electronic device including the sensing device is also provided.

Sensing device and electronic device

A method of manufacturing a sensing device includes: providing a substrate; forming a circuit element on the substrate; forming a sensing element on the substrate; forming a planarization layer on the sensing element and the circuit element; forming a first opening in the planarization layer, wherein the first opening overlaps with the circuit element; and forming a second opening in the planarization layer, wherein the second opening overlaps with the sensing element. In addition, the first opening and the second opening are formed by different processes.

Sensing device, method of manufacturing sensing device and electronic device

An electronic device is provided. The electronic device includes a substrate, a first light-shielding layer, a second light-shielding layer, a third light-shielding layer and an optical sensing element. The first light-shielding layer is disposed on the substrate and has a first opening. The second light-shielding layer is disposed on the first light-shielding layer and has a second opening. The third light-shielding layer is disposed on the second light-shielding layer and has a third opening. The optical sensing element is disposed on the substrate, and overlapped with the first opening. In addition, in a top-view diagram, centers of the first opening, the second opening and the third opening are separated from each other along a first direction, and the first direction is a line connecting a center of the first opening and a center of the third opening.

Electronic device including optical sensing element

A sensing device is provided. The sensing device includes a sensing circuit, a plurality of sensing elements, and a plurality of light-collecting elements. The light-collecting elements are for collecting lights to the plurality of sensing elements. The plurality of sensing elements are configured to generate a plurality of sensing signals according to the lights that are collected, and output the plurality of sensing signals as a whole to the sensing circuit.

Sensing device and electronic device with openings that overlap sensing elements

The present disclosure provides a sensing device and a method for manufacturing the same. The method for manufacturing the sensing device includes the following steps: providing a first temporary substrate, wherein the first temporary substrate includes: a first carrier; a first substrate disposed on the first carrier; and a plurality of sensing elements disposed on the first substrate; providing a second temporary substrate, wherein the second temporary substrate includes: a second carrier; and a second substrate disposed on the second carrier; assembling the first temporary substrate and the second temporary substrate to bond the first substrate and the second substrate; removing the first carrier and disposing the first substrate on a supporting film; and removing the second carrier, wherein the first substrate and the second substrate are respectively a flexible substrate.

Flexible sensing device and method for manufacturing the same

An electronic device is provided. The electronic device includes an optical sensing module that includes an optical sensor array. The optical sensor array includes at least one optical sensor, at least one transparent layer disposed on the optical sensor array, and a microlens array. The microlens array includes at least one microlens and is disposed on the transparent layer.

Electronic device comprisng a micro-lens and photodiode array with amorphic n-type and p-type layers

A card device and a manufacturing method thereof are disclosed. The card device includes a first substrate, a circuit board, a sensing module and a second substrate. The circuit board is disposed on the first substrate, and the circuit board includes an accommodating recess. The sensing module is disposed in the accommodating recess. The sensing module includes a sensing unit and a protective layer formed on the sensing unit, and the sensing unit is electrically connected to the circuit board. The second substrate is disposed on the circuit board. The second substrate includes an opening, and the opening exposes the protective layer.

Card device and method for manufacturing card device

A sensing device includes a plurality of sensing sets having a plurality of lenses and a plurality of sensing units. The sensing units are configured to collect reflected light which pass through the lenses. Each sensing set adopts a structure which includes one sensing unit and multiple lenses for providing fingerprint sensing with high accuracy.

Sensing device

An electronic device is provided. The electronic device includes a substrate, an optical sensing element, a light-shielding structure, and a microlens. The substrate has a normal direction. The optical sensing element is disposed on the substrate. The light-shielding structure is disposed on the optical sensing element and includes a plurality of light-shielding layers. Each light-shielding layer includes an opening, and centers of the openings are arranged along a first direction and separated from each other. The microlens is disposed on the light-shielding layers and overlaps the opening of the uppermost light-shielding layer. The microlens guides light into an optical channel formed by the openings, so that the optical sensing element has a maximum response value for light with an incident angle that is greater than or equal to 10 degrees and less than or equal to 30 degrees relative to the normal direction.

The electronic device includes a substrate; an active layer disposed above the first substrate; a first signal line disposed above the substrate; and a conductive pattern. The conductive pattern is in electrical contact with the active layer, wherein the conductive pattern includes a first side extending in a first direction, a second side extending in the first direction, and a third side connected between the first side and the second side, and wherein the third side includes a part that the part is not parallel to the first direction and not perpendicular to the first direction, and the part is located out of the first signal line.

Electronic device

An optical sensing module and an electronic device are provided. The optical sensing module includes a substrate, a plurality of optical sensing elements, and a light-blocking element. The substrate has a sensing region and a non-sensing region around the sensing region. The plurality of optical sensing elements is disposed on the sensing region. The light-blocking element is disposed on the non-sensing region and a portion of the sensing region. The light-blocking element overlaps a portion of the plurality of optical sensing elements in a normal direction of the substrate.

Optical sensing module and electronic device

An electronic device includes a photodiode, a switching circuit, a readout circuit, and an energy storage device. The photodiode includes a first terminal and a second terminal and is configured to generate a signal according to a light. The switching circuit is electrically connected to the first terminal and the second terminal. When the electronic device operates in a sensing mode, the switching circuit electrically isolates the photodiode from the energy storage device so that the signal is provided to the readout circuit. When the electronic device operates in a charging mode, the switching circuit electrically connects the photodiode to the energy storage device so that the signal is provided to the energy storage device.

Electronic device having a photodiode and capable of switching between light-sensing function and light-charging function

An optical sensing device is disclosed. The optical sensing device includes a sensing pixel, a driving circuit and a first light shielding layer. The sensing pixel includes a sensing circuit and a sensing element electrically connected to the sensing circuit. The driving circuit is electrically connected to the sensing circuit. The first light shielding layer includes at least one first opening corresponding to the sensing element, and the first light shielding layer is overlapped with the driving circuit in a top-view direction of the optical sensing device.

Optical sensing device

A sensing device includes a substrate, a first circuit, a second circuit, a first photodetector, and a second photodetector. The first circuit is disposed on the substrate, and configured to sense a fingerprint. The second circuit is disposed on the substrate, and configured to detect a data of a living body. The first photodetector is electrically connected to the first circuit. The second photodetector is electrically connected to the second circuit. The area of the second photodetector is larger than the area of the first photodetector.

Growing community of inventors

Miao-Li County, Taiwan

Yu-Tsung Liu