Taiwan Semiconductor Manufacturing Comp. Ltd.

Global Unichip Corporation

Yu-Ting Shih

Chia-Jen Kao

Jia-Liang Chen

Chun-Ming Wu

Chen-Wei Hung

Chia-Jung Hsieh

A solid-state storage device includes a housing, a wiring board and a semiconductor package unit. The housing is formed with a heat-dissipating recess thereon. The wiring board is fixed in the housing. One side of the semiconductor package unit is mounted on the wiring board, and the other side of the semiconductor package unit is embedded in the heat-dissipating recess. A top surface and lateral surfaces surrounding the top surface of the semiconductor package unit are all thermally connected to the housing in the heat-dissipating recess.

Solid-state storage device

A testing device includes a circuit board, a carrier, a probe pin, a main body, a shaft, a pressing portion and a resilient spiral spring. The carrier is used to hold a device under test (DUT). The probe pin is electrically connected to the circuit board and the DUT. The shaft is movably connected to the main body with a screwing rotation method. The pressing portion is connected to one end surface of the shaft. The resilient spiral spring is retractably coiled on the shaft, and one end of the resilient spiral spring being far away from the shaft extends in a transverse direction intersecting an axial direction of the shaft.

Testing device

A cleaning apparatus includes a case and a cleaning head. The cleaning head is disposed on the case, and provided with a plurality of tines. The tines are separately arranged abreast. The tines are used to extend into gaps between plural conductive terminals of a semiconductor product for cleaning the semiconductor product.

Growing community of inventors

Hsinchu, Taiwan

Yu-Ting Shih